Deveopment of bonding techniques for cryogenic components, 1; HIP bonding tests between Ti and cryogenic stainless steels

Saito, Shigeru ; Ouchi, Nobuo ; Ishiyama, Shintaro; Tsuchiya, Yoshinori*; Nakajima, Hideo; Fukaya, Kiyoshi*

no abstracts in English

Language	:	Japanese
Report No.	:	JAERI-Tech 2002-048
Pages	:	68 Pages
Publication Year/Month	:	2002/05
Patent information	:
PDF	:	JAERI-Tech-2002-048.pdf:7.86MB
Paper URL	:	https://doi.org/10.11484/jaeri-tech-2002-048
Keywords	:	超伝導加速器; 超伝導コイル; 極低温機器; 異材継手; 純Ti; 極低温用ステンレス; HIP接合
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Registration No. : T20020048
JAEA Abstracts No. : 300775

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