Development of bonding techniques between W and Cu-alloys for plasma facing components by HIP method, 3; Bonding tests with Au-foil insert

Saito, Shigeru ; Fukaya, Kiyoshi*; Ishiyama, Shintaro

no abstracts in English

Language	:	Japanese
Report No.	:	JAERI-Tech 2002-058
Pages	:	30 Pages
Publication Year/Month	:	2002/07
Patent information	:
PDF	:	JAERI-Tech-2002-058.pdf:2.56MB
Paper URL	:	https://doi.org/10.11484/jaeri-tech-2002-058
Keywords	:	プラズマ対向機器; タングステン; 銅合金; HIP法; 接合; 金箔
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Registration No. : T20020058
JAEA Abstracts No. : 300928

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