Development of bonding techniques between tungsten and copper alloy for plasma facing components by HIP method, 1; Bonding between tungsten and Oxygen Free Copper

Saito, Shigeru ; Fukaya, Kiyoshi; Ishiyama, Shintaro; Eto, Motokuni; Akiba, Masato

no abstracts in English

Language	:	Japanese
Report No.	:	JAERI-Research 99-049
Pages	:	36 Pages
Publication Year/Month	:	1999/08
Patent information	:
PDF	:	JAERI-Research-99-049.pdf:3.81MB
Paper URL	:	https://doi.org/10.11484/jaeri-research-99-049
Keywords	:	プラズマ対向機器; タングステン; 無酸素銅; HIP法; 接合; 引張試験; 母材強度
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Article of JAEA R&D Review	:
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Registration No. : S19990049
JAEA Abstracts No. : 271042

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