Development of aluminum (Al5083)-clad ternary Ag-In-Cd alloy for JSNS decoupled moderator

Teshigawara, Makoto   ; Harada, Masahide   ; Saito, Shigeru   ; Oikawa, Kenichi   ; Maekawa, Fujio  ; Futakawa, Masatoshi  ; Kikuchi, Kenji; Kato, Takashi; Ikeda, Yujiro; Naoe, Takashi*   ; Koyama, Tomofumi*; Oi, Toshiyuki*; Zherebtsov, S.*; Kawai, Masayoshi*; Kurishita, Hiroaki*; Konashi, Kenji*

We adopted silver-indium-cadmium (Ag-In-Cd) alloy as a material of decoupler for decoupled moderator in JSNS. However, from the heat removal and corrosion protection points of view, the Ag-In-Cd alloy is needed to clad between Al alloys (Al5083). We attempted to obtain good bonding conditions for between Al5083 and ternary Ag-In-Cd alloys by HIPing tests. The good HIP condition was found for small test piece (20mm). Though a hardened layer due to the formation of AlAg was found in the bonding layer, the rupture strength of the bonding layer was more than 20 MPa, which was the calculated design stress. Bonding tests of a large size piece (20020030 mm), which simulated the real scale, were also performed according to the results of small size tests. The result also gave good bonding and enough required-mechanical-strength, however the rupture strength of the large size test was smaller than that of small one.