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Development of aluminum (Al5083)-clad ternary Ag-In-Cd alloy for JSNS decoupled moderator

Teshigawara, Makoto; Harada, Masahide; Saito, Shigeru; Oikawa, Kenichi; Maekawa, Fujio; Futakawa, Masatoshi; Kikuchi, Kenji; Kato, Takashi; Ikeda, Yujiro; Naoe, Takashi* ; Koyama, Tomofumi*; Oi, Toshiyuki*; Zherebtsov, S.*; Kawai, Masayoshi*; Kurishita, Hiroaki*; Konashi, Kenji*

We adopted silver-indium-cadmium (Ag-In-Cd) alloy as a material of decoupler for decoupled moderator in JSNS. However, from the heat removal and corrosion protection points of view, the Ag-In-Cd alloy is needed to clad between Al alloys (Al5083). We attempted to obtain good bonding conditions for between Al5083 and ternary Ag-In-Cd alloys by HIPing tests. The good HIP condition was found for small test piece ($$Phi$$20mm). Though a hardened layer due to the formation of AlAg$$_{2}$$ was found in the bonding layer, the rupture strength of the bonding layer was more than 20 MPa, which was the calculated design stress. Bonding tests of a large size piece (200$$times$$200$$times$$30 mm$$^{3}$$), which simulated the real scale, were also performed according to the results of small size tests. The result also gave good bonding and enough required-mechanical-strength, however the rupture strength of the large size test was smaller than that of small one.

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Category:Materials Science, Multidisciplinary

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