Further studies on copper nanocomposite with dispersed single-digit-nanodiamond particles

Hanada, Kotaro*; Yamamoto, Kazunori; Taguchi, Tomitsugu; Osawa, Eiji*; Inakuma, Masayasu*; Livramento, V.*; Correia, J, B.*; Shohoji, Nobumitsu*

This paper describes the microstructures and mechanical properties of Cu nanocomposites containing 0-30 at% diamond nanoparticles. The Cu nanocomposite powders are fabricated by mechanical milling method and are consolidated by spark plasma sintering and hot extrusion. Microstructural observation shows that the homogeneous distribution of diamond nanoparticles in the Cu nanocomposite can be achieved by extrusion with large plastic deformation, in spite of 20 at% diamond content, and that the nanocomposite with homogeneous distribution of diamond nanoparticles has ultra-fine grain structure, approximately 50 nm. Vickers hardness and compression tests on the SPS-consolidated and hot-extruded samples show that the detonation nanodiamond dispersed homogeneously in the Cu matrix enhances the mechanical properties.