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Report No.

RBS study of diffusion under strong centrifugal force in bimetallic Au/Cu thin films

Hao, T.; Ono, Masao  ; Okayasu, Satoru  ; Sakai, Seiji; Narumi, Kazumasa; Hiraiwa, Yusuke*; Naramoto, Hiroshi*; Maeda, Yoshihito

We investigate firstly the effect of strong centrifugal force ($$sim$$10$$^{6}$$ G, G = 9.8 m/s$$^{2}$$: SCF) on diffusion behavior in bimetallic Au/Cu thin films. Then SCF were applied with 0.61$$times$$10$$^{6}$$ G in the directions inward (+MG) and outward (-MG) $$alpha$$-Al$$_{2}$$O$$_{3}$$ substrates at 220$$^{circ}$$C for 140 minutes. The Rutherford Backscattering Spectrometry (RBS: 2.7 MeV $$^{4}$$He$$^{+}$$) was used to evaluate the depth profiles of gold and copper atoms for the bimetallic Au/Cu thin films. The results show that in the present condition the diffusion of copper atoms through the gold layer is main process but the diffusion of gold atoms into the copper layers is unobvious for all the cases. Furthermore, it was found that SCF of +MG do not affect distinctly the diffusion of copper atoms through the gold layer, while SCF of -MG can promote damatically the diffusion of copper atoms through gold.



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Category:Instruments & Instrumentation



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