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Report No.

Impact of Ge$$_{3}$$N$$_{4}$$ interface layer on EOT scaling in high-k/Ge gate stacks

Kutsuki, Katsuhiro*; Okamoto, Gaku*; Hideshima, Iori*; Uenishi, Yusuke*; Kirino, Takashi*; Harries, J.; Yoshigoe, Akitaka ; Teraoka, Yuden; Hosoi, Takuji*; Shimura, Takayoshi*; Watanabe, Heiji*

Direct deposition of ZrO$$_{2}$$ films on Ge substrates and subsequent thermal oxidation results in an equivalent oxide thickness (EOT) of above 2 nm while obtaining good interface quality due to interfacial GeO$$_{2}$$ formation. In this work, we proposed the use of Ge$$_{3}$$N$$_{4}$$ interlayer formed by high-density plasma nitridation for further EOT scaling because of its high resistance to oxidation and superior thermal stability. The structural modification of ZrO$$_{2}$$/Ge$$_{3}$$N$$_{4}$$/Ge after oxidation was characterized by synchrotron-radiation X-ray photoelectron spectroscopy at BL23SU in SPring-8. Ge 3d core-level spectra revealed that the Ge$$_{3}$$N$$_{4}$$ interlayer was slightly oxidized after thermal oxidation at 823 K, but N 1s spectra remained almost unchanged. This indicates that the Ge$$_{3}$$N$$_{4}$$ interlayer is effective in suppressing interfacial oxidation, thus obtaining an EOT of 1.8 nm.



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