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Concentration of carbon in the etching of Si(001) surface by oxygen molecules

Hozumi, Hideaki*; Ogawa, Shuichi*; Yoshigoe, Akitaka ; Ishizuka, Shinji*; Harries, J.; Teraoka, Yuden; Takakuwa, Yuji*

The oxidation kinetics on the Si$$_{1-x}$$C$$_{x}$$ alloy layer was investigated using the real-time XPS measurement to reveal the oxidation mechanism of Si alloy layer. Experiments were performed using the surface reaction analysis apparatus placed at the BL23SU of SPring-8. The Si$$_{1-x}$$C$$_{x}$$ alloy layer was formed with ethylene (C$$_{2}$$H$$_{4}$$) exposure to Si(001) surface and then that surface was oxidized at 963K. An oxidation rate of the Si$$_{1-x}$$C$$_{x}$$ alloy layer is faster than that of a clean Si surface. The C 1s photoelectron intensity decreased by 10% in spite of the etching of 45 Si layers due to SiO desorption. Based on these results, it is suggested that all C atoms diffuse into Si substrate due to oxidation-induced strain.

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