Numerical simulation of current distribution in cable-in-conduit conductor for ITER TF coil

Kajitani, Hideki*; Ishiyama, Atsushi*; Koizumi, Norikiyo; Murakami, Haruyuki; Nakajima, Hideo

The critical current of cable-in-conduit conductor (CICC) for ITER TF coil was measured using SULTAN test facility. However, it was found that a non-uniform current distribution was established due to a non-uniform joint resistance. To more precisely evaluate critical current performance, solder filling joint was applied. To study the effect of solder filled joint on the current distribution, the authors developed a new analysis model. The lumped circuit model and distributed circuit model were used for the conductor and joint, respectively, and they are combined. This allow us to avoid iteration to solve distributed circuit equation, resulting in much reduction of calculation time. The simulation results show that although non-uniform current distribution can be established by ramping current, it is improved at current sharing temperature. Thus, the efficiency of solder filling joint is indicated.