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Impact of interface defect passivation on conduction band offset at SiO$$_{2}$$/4H-SiC interface

Hosoi, Takuji*; Kirino, Takashi*; Chanthaphan, A.*; Uenishi, Yusuke*; Ikeguchi, Daisuke*; Yoshigoe, Akitaka ; Teraoka, Yuden; Mitani, Shuhei*; Nakano, Yuki*; Nakamura, Takashi*; Shimura, Takayoshi*; Watanabe, Heiji*

The energy band alignments of thermally grown SiO$$_{2}$$/SiC structures were investigated by means of synchrotron radiation photoelectron spectroscopy (SR-PES) and electrical characterization of SiC-MOS capacitors. In order to determine the energy band alignments of SiO$$_{2}$$/SiC, band gaps of the thermal oxides and valence band offsets at the interface were examined by SR-PES. SiC-MOS capacitors with Al electrodes were also fabricated to evaluate interface state density and conduction band offset. Experimental results indicate that hydrogen atoms are effective to terminate carbon-related defects. It can be concluded that interface quality degradation due to hydrogen desorption by vacuum annealing causes reduction of conduction band offset for thermally grown SiO$$_{2}$$/SiC structure.

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