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表面X線散乱法による固液界面のダイナミクス追跡

Study on dynamics of solid/electrolyte interface using surface X-ray scattering

田村 和久   

Tamura, Kazuhisa

固液界面は、様々な化学反応の反応場であり、まさに重要な反応場の1つである。固液界面で起こる反応の代表の1つが電気化学反応であり、これは、界面での電子授受を伴う化学反応である。これまでの多くの研究により、電極表面の構造や組成と電気化学反応の反応性との間には強い相関があることが明らかになっている。本稿では、筆者が行ってきたAu上へのBiの電析反応に関する実験を中心に、放射光を用いたSXS法による、電極表面の構造変化のダイナミクスの追跡に関する研究について紹介する。

Electrochemical reaction is one of the reactions which occur at solid/liquid interfaces. In the last three decades, relationships between reactivity and structure of solid/liquid interface, especially, electrode surface structure were uncovered using various techniques. Thus, nowadays it has been well recognized the importance of the study of electrode surface structures in in situ condition. However, dynamics of electrode surface structure has been well uncovered. Surface X-ray scattering (SXS) is one of the in situ techniques which can be applied to the study of the solid/liquid interface structures. One of the advantages of SXS is that measurements can be carried out under ideal electrochemical conditions. In this review, dynamics in underpotential deposition process of Bi on Au(111) electrode studied using surface X-ray scattering will be reported.

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