Development of coupled method of fluid-structure thermal interaction simulation and thermal stress analysis for T-junction piping system

Tanaka, Masaaki  ; Miyake, Yasuhiro*; Karakida, Yasuhisa*

A coupled method of fluid-structure thermal interaction simulation and thermal stress analysis has been developed through the interface program to carry out direct numerical estimation of the thermal fatigue. The prototype method was applied to the thermal mixing phenomena in T-junction Piping System.