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Thermal aging effect for creep properties on Ni base refractory alloys

Ishijima, Yasuhiro; Ueno, Fumiyoshi

In this study, to evaluate the effect of thermal aging on creep properties of Alloy 625, we carried out creep tests on aged and solution-treated Alloy 625 at 1073 K. According to the creep test results, time-to-rupture decreased by thermal aging when test stress was more than 100 MPa, but did not change when test stress was less than 100 MPa for any specimens. In the solution-treated alloy, creep deformation behaviors changed over 100 MPa. These results show that time-to-rupture was constant because intermetallic compounds precipitated when the test stress was less than 100 MPa in solution-treated alloy. The observed relationship between creep strain rate and test time showed that the precipitation started after 100 hr for solution treated alloys. These results suggest that intermetallic compounds precipitate immediately after furnace operation. And it is appropriate to use creep data of thermal-aged Alloy 625 for the reducing roasting furnace lifetime prediction.

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