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In-situ TEM observation under tensile loading in bubble dispersion strengthen copper

Shi, S.*; Ono, Naoko*; Ukai, Shigeharu*; Hayashi, Shigenari*; Togo, Koichi*; Fukumoto, Kenichi*; Abe, Yosuke  

Bubble dispersion strengthened (BDS) copper was synthesized by using the dissociated gases of the poly methyl methacrylate (PMMA) during Spark Plasma Sintering (SPS). By in-situ TEM observation under tensile loading, we analyzed a detachment angle of the dislocation from the bubble, and evaluated the pinning force of bubble for the moving dislocations. TEM observation showed homogeneously dispersed bubbles in Cu-5vol$$%$$PMMA and average bubble size was about 10 nm in diameter. It was analyzed that dispersed bubbles can strengthen copper with an angle 79$$^{circ}$$ at dislocation detached from bubbles, which was consistent with the interaction angle 74$$^{circ}$$ estimated by Vickers hardness measurement of the same specimen.

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