Effect of copper addition on precipitation behavior near grain boundary in Al-Zn-Mg alloy

Matsuda, Kenji*; Yasumoto, Toru*; Bendo, A.*; Tsuchiya, Taiki*; Lee, S.*; Nishimura, Katsuhiko*; Nunomura, Norio*; Marioara, C. D.*; Lervik, A.*; Holmestad, R.*; Toda, Hiroyuki*; Yamaguchi, Masatake ; Ikeda, Kenichi*; Homma, Tomoyuki*; Ikeno, Susumu*

no abstracts in English

Language	:	English
Journal	:	Materials Transactions
Volume	:	60
Number	:	8
Pages	:	p.1688 - 1696
Publication Year/Month	:	2019/08
Meeting title	:
Held date	:
Location (city)	:
Location (country)	:
Patent information	:
PDF	:
Paper URL	:	https://doi.org/10.2320/matertrans.L-M2019828
DOI for research data	:
Keywords	:	no keyword
Research Facility	:
Press Release	:
Article of JAEA R&D Review	:
Cooperating Institute	:	科学技術振興機構

Accesses	:	- Accesses
Web of Science® Times Cited Count	:	Times Cited Count： If you would like to get the latest times cited, please access the Web of Science®. http://www.webofknowledge.com/wos
InCites™	:	Percentile:63.04 Category:Materials Science, Multidisciplinary
Altmetrics	:

Registration No. : AA20200522
JAEA Abstracts No. : 48001310
Paper Submission No. : 23550

[CLARIVATE ANALYTICS], [WEB OF SCIENCE], [HIGHLY CITED PAPER & CUP LOGO] and [HOT PAPER & FIRE LOGO] are trademarks of Clarivate Analytics, and/or its affiliated company or companies, and used herein by permission and/or license.