Fundamental study on wettability of pure metal using a low-melting temperature alloy; A Theoretical approach

低融点合金を用いた純金属の濡れ性に関する基礎的研究; 理論的アプローチ

斉藤 淳一  ; 小林 洋平*; 澁谷 秀雄*

Saito, Junichi; Kobayashi, Yohei*; Shibutani, Hideo*

Wettability of pure metal by liquid sodium has been studied in order to control the wettability. In order to understand theoretically the wettability the electronic state of interface between liquid metal and substrate metal calculated and an atomic bonding at interface obtained. Consequently, it became clear that the contact angle which is one of indications of wettability was related with the atomic bonding at interface. An electronic state of interface between liquid low-melting temperature alloy and pure metal was calculated to evaluate the experimental results of wettability of pure metal using the low-melting temperature alloy. And the contact angle was evaluated by the atomic bonding of interface. The molecular orbital calculation was utilized for the calculation of electronic state of interface. The low-melting temperature alloy consists of bismuth, tin and indium. Aluminum, titanium, iron, nickel, copper, zirconium, niobium and molybdenum were selected as the substrate metal. From the calculation result an electronic density of state of interface was similar to that of bulk metal. It means the electronic state of interface was expressed well in this calculation. It became clear that an atomic bonding at interface changed with the atomic number of substrate metal. We will report a relationship between the atomic bonding and the contact angle of wettability in the presentation.