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Impact of post-nitridation annealing in CO$$_{2}$$ ambient on threshold voltage stability in 4H-SiC metal-oxide-semiconductor field-effect transistors

Hosoi, Takuji*; Osako, Momoe*; Moges, K.*; Ito, Koji*; Kimoto, Tsunenobu*; Sometani, Mitsuru*; Okamoto, Mitsuo*; Yoshigoe, Akitaka ; Shimura, Takayoshi*; Watanabe, Heiji*

The combination of NO annealing and subsequent post-nitridation annealing (PNA) in CO$$_{2}$$ ambient for SiO$$_{2}$$/SiC structures has been demonstrated to be effective in obtaining both high channel mobility and superior threshold voltage stability in SiC-based metal-oxide-semiconductor field-effect transistors (MOSFETs). N atoms on the SiO$$_{2}$$ side of the SiO$$_{2}$$/SiC interface incorporated by NO annealing, which are plausible cause of charge trapping sites, could be selectively removed by CO$$_{2}$$-PNA at 1300$$^{circ}$$C without oxidizing the SiC. CO$$_{2}$$-PNA was also effective in compensating oxygen vacancies in SiO$$_{2}$$, resulting high immunity against both positive and negative bias-temperature stresses.

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Category:Physics, Applied

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