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Report No.
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Evaluation of contact thermal resistance in thermal conductivity measurement using unidirectional heat flow steady state comparison method

Ono, Tatsumi*; Hayakawa, Kosetsu*; Oda, Masato*; Ishii, Hiroyuki*; Honda, Mitsunori   ; Muraguchi, Masakazu*

The contact thermal resistance of each interface in the measurement of thermal conductivity using the one-way steady-state heat flow comparison method was decomposed into elements and extracted by performing actual measurements. This method provides a guideline for correcting errors in measurement results due to contact resistance between test rods. In the future, we will further improve the accuracy of the measurement system by correcting for contact thermal resistance.

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