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Oral presentation

Operation and management of chemical processing facility after the Great East Japan Earthquake

Funakoshi, Tomomasa; Ogasawara, Koji; Nakajima, Yasuo; Nomura, Kazunori

no journal, , 

no abstracts in English

Oral presentation

Oral presentation

Development of radiation-resistant straight tube LED lighting at Chemical Processing Facility

Funakoshi, Tomomasa; Shibata, Atsuhiro; Kitawaki, Shinichi; Yajima, Hiroshi*; Masaoka, Hideki*; Koka, Masashi*

no journal, , 

no abstracts in English

Oral presentation

High resistance LED light for irradiation and chemicals

Kobayashi, Yuki; Funakoshi, Tomomasa; Shinozaki, Tadahiro; Watanabe, So; Yajima, Hiroshi*; Masaoka, Hideki*; Saitani, Akihiro*

no journal, , 

The Chemical Processing Facility (CPF) has the concrete-shielded hot-cells using the mercury lamps. However, all the production, export and import of the mercury lamp have been prohibited since 2021 by the Minamata Convention on Mercury, and substitutes of the lamps are required. In this study, the LED lamps with high resistance against exposure to the irradiation and the chemicals are developed for a substitute of the mercury lamp. As the results, newly developed high resistance LED lamps can be operated continuously for more than 20 years under the environment in the respect of the irradiation resistance. Use of the LED lamps will reduce the operational cost and the amount of wastes of the facility. Practical demonstration of the lamps in the hot-cells of the CPF will be performed in near future. lamps will reduce the operational cost and the amount of wastes of the facility. Practical demonstration of the lamps in the hot-cells of the CPF will be performed in near future.

Patent

耐放射線直管型LEDランプ及び照明装置

船越 智雅; 篠崎 忠宏; 小林 雄樹; 薩田 将年

矢島 裕史*; 正岡 秀樹*; 村上 昭二*

JP, 2021-049719  Patent licensing information

【課題】原子力施設で用いるのに適したランプを提供する。 【解決手段】耐放射線直管型LEDランプ(10)は、表面に無機絶縁反射膜が形成された光源基板、及び光源基板の無機絶縁反射膜上に実装されたLED素子を有する光源部(12)と、前面で光源部を支持し、背面に複数のフィン(11C)が立設されたヒートシンク(11)と、ヒートシンクの長手方向の両側の端面それぞれに取り付けられて、電力が供給されるソケットに着脱される口金(13A,13B)と、ヒートシンクの端面及び口金の間に配置されるリングパッキン(14A,14B,15A,15B)と、口金及びLED素子を電気的に接続する導電線(28A,28B)とを備え、ヒートシンクは、端面と前面とに開口する内部通路(11F,11G)を有し、導電線は、リングパッキンの内側及び内部通路を通って、口金及びLED素子を電気的に接続する。

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