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Journal Articles

Performance study of a new LiCAF:Ce detector developed for high-efficient neutron detection in intense $$gamma$$-ray fields

Kaburagi, Masaaki; Kamada, Kei*; Ishii, Junya*; Matsumoto, Tetsuro*; Manabe, Seiya*; Masuda, Akihiko*; Harano, Hideki*; Kato, Masahiro*; Shimazoe, Kenji*

Journal of Instrumentation (Internet), 19(11), p.P11019_1 - P11019_16, 2024/11

 Times Cited Count:0 Percentile:0.00(Instruments & Instrumentation)

Journal Articles

Impact of irradiation side on muon-induced single-event upsets in 65-nm Bulk SRAMs

Deng, Y.*; Watanabe, Yukinobu*; Manabe, Seiya*; Liao, W.*; Hashimoto, Masanori*; Abe, Shinichiro; Tampo, Motonobu*; Miyake, Yasuhiro*

IEEE Transactions on Nuclear Science, 71(4, Part 2), p.912 - 920, 2024/04

 Times Cited Count:0 Percentile:0.00(Engineering, Electrical & Electronic)

With the miniaturization of semiconductors and the decrease in operating voltage, there is a growing interest and discussion in whether the muons in cosmic rays may be the source of single event upsets (SEUs). In the case of neutron-induced SEUs, it was reported that the irradiation side has the impact on SEU cross sections. Here, to investigate the impact of irradiation direction on muon-induced SEUs, we have measured and simulate muon-induced SEUs in 65-nm bulk SRAMs with different muon irradiation directions. It was found that the peak SEU cross section for the package side irradiation is about twice large as that for the board side irradiation. We also revealed that the difference in observed SEU cross sections between the package side and the board side irradiation is caused by differences in energy straggling due to changes in penetration depth depending on the incident direction.

Journal Articles

Measurement of single-event upsets in 65-nm SRAMs under irradiation of spallation neutrons at J-PARC MLF

Kuroda, Junya*; Manabe, Seiya*; Watanabe, Yukinobu*; Ito, Kojiro*; Liao, W.*; Hashimoto, Masanori*; Abe, Shinichiro; Harada, Masahide; Oikawa, Kenichi; Miyake, Yasuhiro*

IEEE Transactions on Nuclear Science, 67(7), p.1599 - 1605, 2020/07

 Times Cited Count:4 Percentile:34.76(Engineering, Electrical & Electronic)

Soft errors induced by terrestrial radiation in semiconductor devices have been of concern from the viewpoint of their reliability. Generally, to evaluate the soft error rates (SERs), neutron irradiation tests are performed at neutron facility. We have performed SER measurement for the 65-nm bulk SRAM and the FDSOI SRAM at RCNP in Osaka University and CYRIC in Tohoku University. In this study, we performed SER measurement for the same devices at BL10 in J-PARC MLF. The increasing rate of SER by reducing the supply voltage at J-PARC BL10 is larger than those obtained at RCNP and CYRIC. From PHITS simulation, the cause of this difference can be explained by the influence of the protons generated by neutron elastic scattering with hydrogen atoms in the package resin.

Journal Articles

Impact of the angle of incidence on negative muon-induced SEU cross sections of 65-nm Bulk and FDSOI SRAMs

Liao, W.*; Hashimoto, Masanori*; Manabe, Seiya*; Watanabe, Yukinobu*; Abe, Shinichiro; Tampo, Motonobu*; Takeshita, Soshi*; Miyake, Yasuhiro*

IEEE Transactions on Nuclear Science, 67(7), p.1566 - 1572, 2020/07

 Times Cited Count:2 Percentile:17.49(Engineering, Electrical & Electronic)

Muon-induced single event upset (SEU) is predicted to increase with technology scaling. The angle of incidence of terrestrial muons is not always perpendicular to the chip surface. Consequently, the impact of the angle of incidence of muons on SEUs should be evaluated. This study conducts negative muon irradiation tests on bulk SRAM and FDSOI SRAM at two angles of incidence: 0 degree (vertical) and 45 degree (tilted). The tilted incidence drifts the muon energy peak to a higher energy. Moreover, the SEU characteristics (i.e., such as the voltage dependences of the SEU cross sections and multiple cells upset patterns) between the vertical and tilted incidences are similar.

Journal Articles

Impact of hydrided and non-hydrided materials near transistors on neutron-induced single event upsets

Abe, Shinichiro; Sato, Tatsuhiko; Kuroda, Junya*; Manabe, Seiya*; Watanabe, Yukinobu*; Liao, W.*; Ito, Kojiro*; Hashimoto, Masanori*; Harada, Masahide; Oikawa, Kenichi; et al.

Proceedings of IEEE International Reliability Physics Symposium (IRPS 2020) (Internet), 6 Pages, 2020/04

 Times Cited Count:2 Percentile:56.23(Engineering, Electrical & Electronic)

Single event upsets (SEUs) caused by neutrons have been recognized as a serious reliability problem for microelectronic devices on the ground level. In our previous work, it was found that hydride placed in front of the memory chip has considerably impact on SEU cross sections because H ions generated via elastic scattering of neutrons with hydrogen atoms are only emitted in a forward direction. In this study, the effect of components neighboring transistors on neutron-induced SEUs was investigated for 65-nm bulk SRAMs by using PHITS. It was found that the shape of the SEU cross section around few MeV comes from the thickness and the position of components placed in front of transistors when that components do not contains hydrogen atoms. By considering components adjoin memory cells in the test board used in the simulation, measured data at J-PARC BL10 were reproduced well. In addition, it was found that the effect of components neighboring transistors on neutron-induced SERs does not negligible in terrestrial environment.

Journal Articles

Similarity analysis on neutron- and negative muon-induced MCUs in 65-nm bulk SRAM

Liao, W.*; Hashimoto, Masanori*; Manabe, Seiya*; Abe, Shinichiro; Watanabe, Yukinobu*

IEEE Transactions on Nuclear Science, 66(7), p.1390 - 1397, 2019/07

 Times Cited Count:14 Percentile:77.49(Engineering, Electrical & Electronic)

Multiple-cell upset (MCU) in static random access memory (SRAM) is a major concern in radiation effects on microelectronic devices since it can spoil error correcting codes. Neutron-induced MCUs have been characterized for terrestrial environment. On the other hand, negative muon-induced MCUs were recently reported. Neutron- and negative muon-induced MCUs are both caused by secondary ions, and hence, they are expected to have some similarity. In this paper, we compare negative muon- and neutron-induced MCUs in 65-nm bulk SRAMs at the irradiation experiments using spallation and quasi-monoenergetic neutrons and monoenergetic negative muons. The measurement results show that the dependencies of MCU event cross section on operating voltage are almost identical. The Monte Carlo simulation is conducted to investigate the deposited charge. The distributions of deposited charge obtained by the simulation are consistent with the above-mentioned experimental observations.

Journal Articles

Impact of irradiation side on neutron-induced single-event upsets in 65-nm Bulk SRAMs

Abe, Shinichiro; Liao, W.*; Manabe, Seiya*; Sato, Tatsuhiko; Hashimoto, Masanori*; Watanabe, Yukinobu*

IEEE Transactions on Nuclear Science, 66(7, Part 2), p.1374 - 1380, 2019/07

 Times Cited Count:11 Percentile:69.57(Engineering, Electrical & Electronic)

Single event upsets (SEUs) caused by secondary cosmic-ray neutrons have recognized as a serious reliability problem for microelectronic devices. Acceleration tests at neutron facilities are convenient to validate soft error rates (SERs) quickly, but some corrections caused from measurement conditions are required to derive realistic SERs at actual environment or to compare other measured data. In this study, the effect of irradiation side on neutron-induced SEU cross sections was investigated by performing neutron transport simulation using PHITS. SERs for 65-nm bulk CMOS SRAMs are estimated using the sensitive volume model. It was found from simulation that SERs for the sealant side irradiation are 30-50% larger than those for the board side irradiation. This difference comes from the difference of production yield and angular distribution of secondary H and He ions, which are the main cause of SEUs. Thus the direction of neutron irradiation should be reported when the result of acceleration tests are published. This result also indicates that SERs can be reduced by equipping device with sealant side facing downward.

Journal Articles

Estimation of muon-induced SEU rates for 65-nm bulk and UTBB-SOI SRAMs

Manabe, Seiya*; Watanabe, Yukinobu*; Liao, W.*; Hashimoto, Masanori*; Abe, Shinichiro

IEEE Transactions on Nuclear Science, 66(7), p.1398 - 1403, 2019/07

 Times Cited Count:10 Percentile:66.26(Engineering, Electrical & Electronic)

Cosmic ray-induced soft errors have been recognized as a major threat for electronics used at ground level. Recently, cosmic-ray muon-induced soft errors have received much attention due to the reduction of soft error immunity on SRAMs. In the previous studies, muon-induced soft error rates (SERs) for various technology devices were predicted with only the positive muon irradiation tests and simulation. In this paper, the muon-induced SEU rates for the 65-nm bulk and UTBB-SOI SRAMs are estimated by using the experimental data of both negative and positive muons. The experimental results showed that the negative muon SEU cross sections for the bulk SRAM are significantly larger than those for the UTBB-SOI. Estimation of muon-induced SEU rates at ground level was performed using PHITS with the experimental results. The muon-induced SER on the first floor of the building was estimated to be at most 10% of the neutron-induced SER on the same floor.

Journal Articles

Negative and positive muon-induced single event upsets in 65-nm UTBB SOI SRAMs

Manabe, Seiya*; Watanabe, Yukinobu*; Liao, W.*; Hashimoto, Masanori*; Nakano, Keita*; Sato, Hikaru*; Kin, Tadahiro*; Abe, Shinichiro; Hamada, Koji*; Tampo, Motonobu*; et al.

IEEE Transactions on Nuclear Science, 65(8), p.1742 - 1749, 2018/08

 Times Cited Count:14 Percentile:73.48(Engineering, Electrical & Electronic)

Recently, the malfunction of microelectronics caused by secondary cosmic-ray muon is concerned as semiconductor devices become sensitive to radiation. In this study, we have performed muon irradiation testing for 65-nm ultra-thin body and thin buried oxide (UTBB-SOI) SRAMs in the Japan Proton Accelerator Research Complex (J-PARC), in order to investigate dependencies of single event upset (SEU) cross section on incident muon momentum and supply voltage. It was found that the SEU cross section by negative muon are approximately two to four times larger than those by positive muon in the momentum range from 35 MeV/c to 39 MeV/c. The supply voltage dependence of muon-induced SEU cross section was measured with the momentum of 38 MeV/c. SEU cross sections decrease with increasing supply voltage, but the decreasing of SEU cross section by negative muon is gentler than that by positive muon. Experimental data of positive and negative muon irradiation with the momentum of 38 MeV/c were analyzed by PHITS. It was clarified that the negative muon capture causes the difference between the SEU cross section by negative muon and that by positive muon.

Journal Articles

Measurement and mechanism investigation of negative and positive muon-induced upsets in 65-nm Bulk SRAMs

Liao, W.*; Hashimoto, Masanori*; Manabe, Seiya*; Watanabe, Yukinobu*; Abe, Shinichiro; Nakano, Keita*; Sato, Hikaru*; Kin, Tadahiro*; Hamada, Koji*; Tampo, Motonobu*; et al.

IEEE Transactions on Nuclear Science, 65(8), p.1734 - 1741, 2018/08

 Times Cited Count:20 Percentile:84.57(Engineering, Electrical & Electronic)

Soft error induced by secondary cosmic-ray muon is concerned since susceptibility of semiconductor device to soft error increases with the scaling of technology. In this study, we have performed irradiation tests of muons on 65-nm bulk CMOS SRAM in the Japan Proton Accelerator Research Complex (J-PARC) and measured soft error rate (SER) to investigate mechanism of muon-induced soft errors. It was found that SER by negative muon increases above 0.5 V supply voltage, although SER by positive muon increases monotonically as the supply voltage lowers. SER by negative muon also increases with forward body bias. In addition, negative muon causes large multiple cell upset (MCU) of more than 20 bits and the ratio of MCU events to all the events is 66% at 1.2V supply voltage. These tendencies indicate that parasitic bipolar action (PBA) is highly possible to contribute to SER by negative muon. Experimental data are analyzed by PHITS. It was found that negative muon can deposit larger charge than positive muon, and such events that can deposit large charge may trigger PBA.

Oral presentation

Measurement of Cu-63(n,p)Ni-63 production cross section, 1; Measurement of spatial distribution of thermal neutron irradiation dose in irradiation capsule using activation of gold

Nakasone, Shunya*; Yoshii, Taiki*; Shibuya, Kengo*; Yunoki, Akira*; Sakai, Hirotaka*; Shimada, Taro; Manabe, Seiya*; Matsumoto, Tetsuro*

no journal, , 

Cable has become subject to clearance since the revision of the clearance regulations. Ni-63, a nuclide that is difficult to measure, is produced by the activation of copper in cables. When calculating the amount of Ni-63 produced, the activation cross section in the thermal neutron region differs by a factor of about 6 between nuclear data libraries, so that accurate activation calculations have not been possible. Therefore, the purpose of this study is to improve the accuracy of the calculation of Cu activation and to estimate the reaction cross section of Cu-63(n,p)Ni-63 in the thermal neutron region with good accuracy based on actual measurements. In this presentation, the uncertainty of the thermal neutron fluence contributing to the Cu activation was evaluated using Au-198 after neutron irradiation at JRR-3 in JAEA. High-purity gold and copper samples were placed alternately, and the entire sample was packaged in aluminum foil and sealed in an irradiation capsule, which was placed at the bottom of JRR-3 HR-2 with the capsule lid facing upward. Three irradiation capsules were prepared and irradiated with neutrons for 10, 20, and 30 minutes, respectively. About 50 days after irradiation, the radioactivity was measured using a Ge semiconductor detector. The results showed that the radioactivity per unit mass of gold samples irradiated in each irradiation was the highest in the sample placed at the top of the capsule and decreased by 6$$sim$$8% toward the bottom of the capsule. This trend is reasonable. The average value of the thermal neutron fluence rate for all samples was 7 $$times$$ 10$$^{13}$$ cm$$^{-2}$$ s$$^{-1}$$. These results confirm that the thermal neutron fluence can be determined with an accuracy on the order of percent.

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