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Journal Articles

Formation of high-quality SiO$$_{2}$$/GaN interfaces with suppressed Ga-oxide interlayer via sputter deposition of SiO$$_{2}$$

Onishi, Kentaro*; Kobayashi, Takuma*; Mizobata, Hidetoshi*; Nozaki, Mikito*; Yoshigoe, Akitaka; Shimura, Takayoshi*; Watanabe, Heiji*

Japanese Journal of Applied Physics, 62(5), p.050903_1 - 050903_4, 2023/05

https://doi.org/10.35848/1347-4065/acd1ca
 Times Cited Count：4 Percentile：63.08(Physics, Applied)

While the formation of an GaO$$_{x}$$ interlayer is key to achieving SiO$$_{2}$$/GaN interfaces with low defect density, it can affect the reliability and stability of metal-oxide-semiconductor (MOS) devices if the annealing conditions are not properly designed. In the present study, we aimed to minimize the growth of the GaO$$_{x}$$ layer on the basis of the sputter deposition of SiO$$_{2}$$ on GaN. Synchrotron radiation X-ray photoelectron spectrometry measurements confirmed the suppressed growth of the GaO$$_{x}$$ layer compared with a SiO$$_{2}$$/GaN structure formed by plasma-enhanced chemical vapor deposition. Negligible GaO$$_{x}$$ growth was also observed when subsequent oxygen annealing up to 600$$^{circ}$$C was performed. A MOS device with negligible capacitance-voltage hysteresis, nearly ideal flat-band voltage, and low leakage current was demonstrated by performing oxygen and forming gas annealing at temperatures of 600$$^{circ}$$C and 400$$^{circ}$$C, respectively.

Journal Articles

Electrical properties and energy band alignment of SiO$$_{2}$$/GaN metal-oxide-semiconductor structures fabricated on N-polar GaN(000$$bar{1}$$) substrates

Mizobata, Hidetoshi*; Tomigahara, Kazuki*; Nozaki, Mikito*; Kobayashi, Takuma*; Yoshigoe, Akitaka; Hosoi, Takuji*; Shimura, Takayoshi*; Watanabe, Heiji*

Applied Physics Letters, 121(6), p.062104_1 - 062104_6, 2022/08

https://doi.org/10.1063/5.0095468
 Times Cited Count：1 Percentile：9.28(Physics, Applied)

The interface properties and energy band alignment of SiO$$_{2}$$/GaN metal-oxide-semiconductor (MOS) structures fabricated on N-polar GaN(000$$bar{1}$$) substrates were investigated by electrical measurements and synchrotron-radiation X-ray photoelectron spectroscopy. They were then compared with those of SiO$$_{2}$$/GaN MOS structures on Ga-polar GaN(0001). Although the SiO$$_{2}$$/GaN(000$$bar{1}$$) structure was found to be more thermally unstable than that on the GaN(0001) substrate, excellent electrical properties were obtained for the SiO$$_{2}$$/GaN(000$$bar{1}$$) structure by optimizing conditions for post-deposition annealing. However, the conduction band offset for SiO$$_{2}$$/GaN(000$$bar{1}$$) was smaller than that for SiO$$_{2}$$/GaN(0001), leading to increased gate leakage current. Therefore, caution is needed when using N-polar GaN(000$$bar{1}$$) substrates for MOS device fabrication.

Journal Articles

Evaluation and mitigation of reactive ion etching-induced damage in AlGaN/GaN MOS structures fabricated by low-power inductively coupled plasma

Nozaki, Mikito*; Terashima, Daiki*; Yoshigoe, Akitaka; Hosoi, Takuji*; Shimura, Takayoshi*; Watanabe, Heiji*

Japanese Journal of Applied Physics, 59(SM), p.SMMA07_1 - SMMA07_7, 2020/07

https://doi.org/10.35848/1347-4065/ab8f0e
 Times Cited Count：5 Percentile：21.80(Physics, Applied)

AlGaN/GaN metal-oxide-semiconductor (MOS) structures were fabricated by low-power inductively coupled plasma reactive ion etching and chemical vapor deposition of SiO$$_{2}$$ dielectrics on the etched surfaces, and they were systematically investigated by physical and electrical characterizations in an effort to develop a low-damage recessed gate process. The comprehensive research demonstrates the significant advantages of the proposed low-damage recessed gate process for fabricating next-generation AlGaN/GaN MOS-HFET devices.

Journal Articles

Implementation of atomic layer deposition-based AlON gate dielectrics in AlGaN/GaN MOS structure and its physical and electrical properties

Nozaki, Mikito*; Watanabe, Kenta*; Yamada, Takahiro*; Shih, H.-A.*; Nakazawa, Satoshi*; Anda, Yoshiharu*; Ueda, Tetsuzo*; Yoshigoe, Akitaka; Hosoi, Takuji*; Shimura, Takayoshi*; et al.

Japanese Journal of Applied Physics, 57(6S3), p.06KA02_1 - 06KA02_7, 2018/06

https://doi.org/10.7567/JJAP.57.06KA02
 Times Cited Count：21 Percentile：66.94(Physics, Applied)

We fabricated AlON dielectric films by repeating thin AlN deposition and in situ O$$_{3}$$ oxidation for AlGaN/GaN MOS-HFETs. Uniform nitrogen distribution is achievable by the proposed ALD-based process and that nitrogen concentration can be precisely controlled by changing AlN thickness (ALD cycle number) in each step. It was found that AlON films grown by ALD system offers significant advantages in terms of practical application while keeping superior Vth stability and electrical properties at the insulator/AlGaN interface in AlGaN/GaN MOS-HFETs.

Journal Articles

Physical and electrical characterizations of AlGaN/GaN MOS gate stacks with AlGaN surface oxidation treatment

Yamada, Takahiro*; Watanabe, Kenta*; Nozaki, Mikito*; Shih, H.-A.*; Nakazawa, Satoshi*; Anda, Yoshiharu*; Ueda, Tetsuzo*; Yoshigoe, Akitaka; Hosoi, Takuji*; Shimura, Takayoshi*; et al.

Japanese Journal of Applied Physics, 57(6S3), p.06KA07_1 - 06KA07_6, 2018/06

https://doi.org/10.7567/JJAP.57.06KA07
 Times Cited Count：6 Percentile：27.37(Physics, Applied)

Thermal oxidation of AlGaN surface and its impact on the electrical properties of AlGaN/GaN MOS capacitors were investigated by means of synchrotron radiation photoelectron spectroscopy (SR-PES), atomic force microscopy (AFM) and C-V measurements. SR-PES analysis revealed that the AlGaN surface is oxidized even at low temperature of 400$$^{circ}$$C, in contrast to no oxide formation on GaN surface. However, since no noticeable change in the surface morphology was observed at temperatures up to 800$$^{circ}$$C, it can be concluded that an ultrathin oxide overlayer is formed on the AlGaN surface. On the other hand, for the oxidation treatments above 850$$^{circ}$$C, the formation of small oxide grains was observed over the entire area of the AlGaN surface, and the growth of oxide grains significantly degraded the surface morphology. Therefore, the AlGaN/GaN MOS capacitors were fabricated on the AlGaN surface oxidized at moderate temperatures up to 800$$^{circ}$$C. While we have confirmed that relatively good interface properties are obtained for direct AlON deposition without oxidation treatment, it was found that the oxidation treatment at 400$$^{circ}$$C leads to further improvement of interface properties and reduction of C-V hysteresis.

Journal Articles

SiO$$_{2}$$/AlON stacked gate dielectrics for AlGaN/GaN MOS heterojunction field-effect transistors

Watanabe, Kenta*; Terashima, Daiki*; Nozaki, Mikito*; Yamada, Takahiro*; Nakazawa, Satoshi*; Ishida, Masahiro*; Anda, Yoshiharu*; Ueda, Tetsuzo*; Yoshigoe, Akitaka; Hosoi, Takuji*; et al.

Japanese Journal of Applied Physics, 57(6S3), p.06KA03_1 - 06KA03_6, 2018/06

https://doi.org/10.7567/JJAP.57.06KA03
 Times Cited Count：11 Percentile：45.59(Physics, Applied)

The advantage of SiO$$_{2}$$/AlON stacked gate dielectrics over SiO$$_{2}$$, AlON and Al$$_{2}$$O$$_{3}$$ single dielectric layers was demonstrated. Our systematic research revealed that the optimized stacked structure with 3.3-nm-thick AlON interlayer is beneficial in terms of superior interface quality, reduced gate leakage current and C-V hysteresis for next-generation high frequency and high power AlGaN/GaN MOS-HFETs.

Journal Articles

Control of Ga-oxide interlayer growth and Ga diffusion in SiO$$_{2}$$/GaN stacks for high-quality GaN-based metal-oxide-semiconductor devices with improved gate dielectric reliability

Yamada, Takahiro*; Watanabe, Kenta*; Nozaki, Mikito*; Yamada, Hisashi*; Takahashi, Tokio*; Shimizu, Mitsuaki*; Yoshigoe, Akitaka; Hosoi, Takuji*; Shimura, Takayoshi*; Watanabe, Heiji*

Applied Physics Express, 11(1), p.015701_1 - 015701_4, 2018/01

https://doi.org/10.7567/APEX.11.015701
 Times Cited Count：45 Percentile：85.43(Physics, Applied)

A simple and feasible method for fabricating high-quality and highly reliable GaN-based metal-oxide-semiconductor (MOS) devices was developed on the basis of systematic physical and electrical characterizations. Chemical vapor deposition of SiO$$_{2}$$ films directly onto GaN substrates forming Ga-oxide interlayers was used to fabricate SiO$$_{2}$$/GaO$$_{x}$$/GaN stacked structures. Although well-behaved hysteresis-free GaN-MOS capacitors with extremely low interface state density below 10$$^{10}$$cm$$^{-2}$$eV$$^{-1}$$ were obtained by post-deposition annealing, Ga diffusion into overlying SiO$$_{2}$$ layers severely degraded the insulating property and dielectric breakdown characteristics of the MOS devices. However, this problem was found to be solved by employing rapid thermal processing, leading to superior performance of the GaN-MOS devices in terms of interface quality, insulating property and gate dielectric reliability.

Journal Articles

Design and control of interface reaction between Al-based dielectrics and AlGaN Layer in AlGaN/GaN metal-oxide-semiconductor structures

Watanabe, Kenta*; Nozaki, Mikito*; Yamada, Takahiro*; Nakazawa, Satoshi*; Anda, Yoshiharu*; Ishida, Masahiro*; Ueda, Tetsuzo*; Yoshigoe, Akitaka; Hosoi, Takuji*; Shimura, Takayoshi*; et al.

Applied Physics Letters, 111(4), p.042102_1 - 042102_5, 2017/07

https://doi.org/10.1063/1.4986419
 Times Cited Count：17 Percentile：59.59(Physics, Applied)

AlGaN/GaN HFET (hetero-junction field-effect transitor) has gained much attention as next-generation high frequency and high power devices. In this study, we systematically investigated the interface reaction between Al-based dielectrics (Al$$_{2}$$O$$_{3}$$ and AlON) and AlGaN layer during deposition and post-deposition annealing (PDA), and revealed high thermal stability of AlON/AlGaN interface.

Journal Articles

Comprehensive study on initial thermal oxidation of GaN(0001) surface and subsequent oxide growth in dry oxygen ambient

Yamada, Takahiro*; Ito, Joyo*; Asahara, Ryohei*; Watanabe, Kenta*; Nozaki, Mikito*; Nakazawa, Satoshi*; Anda, Yoshiharu*; Ishida, Masahiro*; Ueda, Tetsuzo*; Yoshigoe, Akitaka; et al.

Journal of Applied Physics, 121(3), p.035303_1 - 035303_9, 2017/01

https://doi.org/10.1063/1.4974458
 Times Cited Count：75 Percentile：92.36(Physics, Applied)

Initial oxidation of GaN(0001) epilayers and subsequent growth of thermal oxides in dry oxygen ambient were investigated by means of X-ray photoelectron spectroscopy, spectroscopic ellipsometry, atomic force microscopy and X-ray diffraction measurements. It was found that, whereas initial oxide formation tends to saturate at temperatures below 800$$^{circ}$$C, selective growth of small oxide grains proceeds at dislocations in the epilayers, followed by noticeable grain growth leading to rough surface morphology at higher oxidation temperatures. This indicates that oxide growth and its morphology are crucially dependent on the defect density in the GaN epilayers. Structural characterizations also revealed that polycrystalline $$alpha$$- and $$beta$$-phase Ga$$_{2}$$O$$_{3}$$ grains in an epitaxial relation with the GaN substrate are formed from the initial stage of the oxide growth. On the basis of these experimental findings, we also developed a comprehensive model for GaN oxidation mediated by nitrogen removal and mass transport.

Journal Articles

Synchrotron radiation X-ray photoelectron spectroscopy of Ti/Al ohmic contacts to n-type GaN; Key role of Al capping layers in interface scavenging reactions

Nozaki, Mikito*; Ito, Joyo*; Asahara, Ryohei*; Nakazawa, Satoshi*; Ishida, Masahiro*; Ueda, Tetsuzo*; Yoshigoe, Akitaka; Hosoi, Takuji*; Shimura, Takayoshi*; Watanabe, Heiji*

Applied Physics Express, 9(10), p.105801_1 - 105801_4, 2016/10

https://doi.org/10.7567/APEX.9.105801
 Times Cited Count：7 Percentile：31.49(Physics, Applied)

Interface reactions between Ti-based electrodes and n-type GaN epilayers were investigated by synchrotron radiation X-ray photoelectron spectroscopy. Metallic Ga and thin TiN alloys were formed at the interface by subsequently depositing Al capping layers on ultrathin Ti layers even at room temperature. By comparing results from stacked Ti/Al and single Ti electrodes, the essential role of Al capping layers serving as an oxygen-scavenging element to produce reactive Ti underlayers was demonstrated. Further growth of the metallic interlayer during annealing was observed. A strategy for achieving low-resistance ohmic contacts to n-GaN with low-thermal-budget processing is discussed.

Journal Articles

Effect of nitrogen incorporation into Al-based gate insulators in AlON/AlGaN/GaN metal-oxide-semiconductor structures

Asahara, Ryohei*; Nozaki, Mikito*; Yamada, Takahiro*; Ito, Joyo*; Nakazawa, Satoshi*; Ishida, Masahiro*; Ueda, Tetsuzo*; Yoshigoe, Akitaka; Hosoi, Takuji*; Shimura, Takayoshi*; et al.

Applied Physics Express, 9(10), p.101002_1 - 101002_4, 2016/10

https://doi.org/10.7567/APEX.9.101002
 Times Cited Count：42 Percentile：83.27(Physics, Applied)

The superior physical and electrical properties of AlON gate dielectrics on AlGaN/GaN substrates in terms of thermal stability, reliability, and interface quality were demonstrated by direct AlON deposition and subsequent annealing. Nitrogen incorporation into alumina was proven to be beneficial both for suppressing intermixing at the insulator/AlGaN interface and reducing the number of electrical defects in Al$$_{2}$$O$$_{3}$$ films. Consequently, we achieved high-quality AlON/AlGaN/GaN metal-oxide-semiconductor capacitors with improved stability against charge injection and a reduced interface state density as low as 1.2$$times$$10$$^{11}$$ cm$$^{-2}$$eV$$^{-1}$$. The impact of nitrogen incorporation into the insulator was discussed on the basis of experimental findings.

JAEA Reports

Development of protection system for power supply facilities in JT-60U P-NBI for long pulse operation

Oshima, Katsumi; Okano, Fuminori; Honda, Atsushi; Shinozaki, Shinichi; Usui, Katsutomi; Noto, Katsuya; Kawai, Mikito; Ikeda, Yoshitaka

JAEA-Technology 2007-044, 27 Pages, 2007/06

JAEA-Technology-2007-044.pdf:26.9MB

In the positive ion based NBI (P-NBI) system, we have developed a protection system to protect the power supply facilities from over load during long pulse operation. The protection system monitors the voltage (V) and current (I) in the power supply facilities, and calculates the parameters of V2t and I2t in real-time, where T is the pulse duration. It turns off the power supply facilities when V2t and I2t are beyond the critical values. After two development stages, we have completed the protection system using a package typed PLC (Programmable Logic Controller) which has a high expandability of multi-unit operation. Moreover, we have constructed a user-friendly system by using a SCADA (Supervisory Control and Data Acquisition) system.

Oral presentation

Interface engineering of Al based gate insulators in AlGaN/GaN MOS-HFETs

Watanabe, Kenta*; Nozaki, Mikito*; Yamada, Takahiro*; Nakazawa, Satoshi*; Anda, Yoshiharu*; Ishida, Masahiro*; Ueda, Tetsuzo*; Yoshigoe, Akitaka; Hosoi, Takuji*; Shimura, Takayoshi*; et al.

no journal, , 

AlGaN/GaN HFET (hetero-junction field-effect transitor) has gained much attention as next-generation high frequency and high power devices. Since AlGaN/GaN HFET with Schottky gate is restricted in device application due to large gate leakage current and normally-on operation, MOS gate stack with deposited gate insulator has been widely investigated to overcome these limitations. Among various insulating materials, Al$$_{2}$$O$$_{3}$$ is one of the potential candidates because of its wide bandgap and high thermal stability. In this study, we systematically investigated the interface reaction between Al-based dielectrics (Al$$_{2}$$O$$_{3}$$ and AlON) and AlGaN layer during deposition and post-deposition annealing (PDA), and revealed high thermal stability of AlON/AlGaN interface.

Oral presentation

SiO$$_{2}$$/AlON stacked gate dielectrics for AlGaN/GaN MOS-HFET

Watanabe, Kenta*; Terashima, Daiki*; Nozaki, Mikito*; Yamada, Takahiro*; Nakazawa, Satoshi*; Ishida, Masahiro*; Anda, Yoshiharu*; Ueda, Tetsuzo*; Yoshigoe, Akitaka; Hosoi, Takuji*; et al.

no journal, , 

The advantage of SiO$$_{2}$$/AlON stacked gate dielectrics over SiO$$_{2}$$, AlON and Al$$_{2}$$O$$_{3}$$ single dielectric layers was demonstrated. Our systematic research revealed that the optimized stacked structure with 3.3-nm-thick AlON interlayer is beneficial in terms of superior interface quality, reduced gate leakage current and C-V hysteresis for next-generation high frequency and high power AlGaN/GaN MOS-HFETs.

Oral presentation

AlON gate dielectrics formed by repeating ALD-based thin AlN deposition and in situ oxidation for AlGaN/GaN MOS-HFETs

Nozaki, Mikito*; Watanabe, Kenta*; Yamada, Takahiro*; Shih, H.*; Nakazawa, Satoshi*; Anda, Yoshiharu*; Ueda, Tetsuzo*; Yoshigoe, Akitaka; Hosoi, Takuji*; Shimura, Takayoshi*; et al.

no journal, , 

We fabricated AlON dielectric films by repeating thin AlN deposition and in situ O$$_{3}$$ oxidation for AlGaN/GaN MOS-HFETs. Uniform nitrogen distribution is achievable by the proposed ALD-based process and that nitrogen concentration can be precisely controlled by changing AlN thickness (ALD cycle number) in each step. It was found that AlON films grown by ALD system offers significant advantages in terms of practical application while keeping superior Vth stability and electrical properties at the insulator/AlGaN interface in AlGaN/GaN MOS-HFETs.

Oral presentation

Improvement of interface and insulating properties of sputter-deposited SiO$$_{2}$$/GaN MOS structures by oxygen and hydrogen annealing

Onishi, Kentaro*; Kobayashi, Takuma*; Mizobata, Hidetoshi*; Nozaki, Mikito*; Yoshigoe, Akitaka; Shimura, Takayoshi*; Watanabe, Heiji*

no journal, , 

GaO$$_{x}$$ interlayer at SiO$$_{2}$$/GaN interfaces is easily reduced during the annealing process, leading to threshold voltage instability of MOS devices. In this study, we formed SiO$$_{2}$$ by sputter deposition to minimize the growth of unstable GaO$$_{x}$$ interlayer. Furthermore, by performing oxygen and hydrogen annealing, a stable GaN MOS structure with good interface and insulating properties was realized.

Oral presentation

Influence of deposition power and temperature on SiO$$_{2}$$/AlGaN interface property deposited by PECVD

Terashima, Daiki*; Watanabe, Kenta*; Yamada, Takahiro*; Nozaki, Mikito*; Shih, H.*; Nakazawa, Satoshi*; Anda, Yoshiharu*; Ueda, Tetsuzo*; Yoshigoe, Akitaka; Hosoi, Takuji*; et al.

no journal, , 

Impact of input power and substrate temperature of SiO$$_{2}$$ deposition by plasma-enhanced CVD on SiO$$_{2}$$/AlGaN interface was investigated by means of electrical characterization of MOS capacitors. Synchrotron radiation photoemission spectroscopy revealed that Ga oxide component on AlGaN surface increases with increasing input power of PECVD. MOS capacitors with SiO$$_{2}$$ gate insulator deposited at low input power shows relatively better SiO$$_{2}$$/AlGaN interface quality, despite degraded interface quality for the sample with SiO$$_{2}$$ deposited at high input power. These results suggest that AlGaN surface oxidation during oxide deposition should be controlled to obtain good interface property.

Oral presentation

Effect of nitrogen incorporation into Al-based gate insulator in AlGaN/GaN MOS-HEMT

Asahara, Ryohei*; Nozaki, Mikito*; Yamada, Takahiro*; Ito, Joyo*; Nakazawa, Satoshi*; Ishida, Masahiro*; Ueda, Tetsuzo*; Yoshigoe, Akitaka; Hosoi, Takuji*; Shimura, Takayoshi*; et al.

no journal, , 

AlGaN/GaN high electron mobility transistor (HEMT) with metal-oxide-semiconductor (MOS) gate structure has gained much attention as next-generation high frequency and high power devices. In this study, an improvement in thermal stability and interface properties of AlGaN/GaN MOS structure by using AlON gate dielectrics has been demonstrated. Synchrotron radiation photoemission spectroscopy (SR-PES) revealed that Ga and Al atoms were diffused from AlGaN into overlying Al$$_{2}$$O$$_{3}$$ layer during annealing at 800 degrees. In contrast, the spectra for AlON sample remain almost unchanged even after the annealing, indicating high thermal stability of AlON/AlGaN structure. Furthermore, the negligible hysteresis in capacitance-voltage characteristics and interface state density as low as 1.2$$times$$10$$^{11}$$ cm$$^{-2}$$eV$$^{-1}$$ were obtained for AlON/AlGaN/GaN MOS capacitors.

Oral presentation

Synchrotron radiation X-ray photoelectron spectroscopy study of interface reactions in Al/Ti/GaN ohmic contacts

Nozaki, Mikito*; Ito, Joyo*; Asahara, Ryohei*; Nakazawa, Satoshi*; Ishida, Masahiro*; Ueda, Tetsuzo*; Yoshigoe, Akitaka; Teraoka, Yuden; Hosoi, Takuji*; Shimura, Takayoshi*; et al.

no journal, , 

Interface reactions between Ti-based multilayer electrodes on n-type GaN epilayers were investigated by means of synchrotron radiation X-ray photoelectron spectroscopy (SR-XPS). High-resolution SR-XPS analysis revealed formation of metallic Ga and TiN mixed interlayers at Ti/GaN interface even at room temperature by depositing Al capping layer. By comparing XPS spectra from the stacked Al/Ti electrode and single Ti electrode, an essential role of Al overlayers serving as oxygen diffusion barrier and oxygen scavenging element to produce reactive pure Ti underlayers on GaN was demonstrated. Moreover, growth of metallic interlayers consisting of Ga and Ti atoms during vacuum annealing was clearly identified from in situ SR-XPS analysis.

Oral presentation

Investigation of thermal oxidation process in low-defect density GaN substrate

Yamada, Takahiro*; Yoshigoe, Akitaka; Ito, Joyo*; Asahara, Ryohei*; Watanabe, Kenta*; Nozaki, Mikito*; Nakazawa, Satoshi*; Anda, Yoshiharu*; Ishida, Masahiro*; Ueda, Tetsuzo*; et al.

no journal, , 

Thermal oxidation process of self-standing GaN (ss-GaN) substrates with low-defect density were investigated by atomic force microscopy and synchrotron radiation photoelectron spectroscopy. ss-GaN sample showed a flat surface morphology without pits which are ascribed to dislocation defects in the measured area (1 $$mu$$mx1 $$mu$$m). Therefore, the preferential formation of Ga-oxides at the pits was not observed by thermal oxidation, and the flat surface morphology was kept in the sample oxidized at 800$$^{circ}$$C (the root-mean-square (RMS) roughness of 0.14 nm). However, the ss-GaN sample oxidized at 900$$^{circ}$$C showed rough surface morphology due to the formation of small Ga-oxide grains (RMS roughness of 0.62 nm). The grains drastically grew at 1000$$^{circ}$$C, resulted in the surface morphology consisting of $$beta$$-Ga$$_{2}$$O$$_{3}$$ crystal.

29 (Records 1-20 displayed on this page)