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Kada, Wataru*; Kambayashi, Yuya*; Iwamoto, Naoya*; Onoda, Shinobu; Makino, Takahiro; Koka, Masashi; Kamiya, Tomihiro; Hoshino, Norihiro*; Tsuchida, Hidekazu*; Kojima, Kazutoshi*; et al.
Nuclear Instruments and Methods in Physics Research B, 348, p.240 - 245, 2015/04
Times Cited Count:4 Percentile:32.74(Instruments & Instrumentation)Pastuovi, *; Capan, I.*; Cohen, D.*; Forneris, J.*; Iwamoto, Naoya*; Oshima, Takeshi; Siegele, R.*; Hoshino, Norihiro*; Tsuchida, Hidekazu*
Nuclear Instruments and Methods in Physics Research B, 348, p.233 - 239, 2015/04
Times Cited Count:7 Percentile:50.83(Instruments & Instrumentation)Makino, Takahiro; Deki, Manato; Iwamoto, Naoya; Onoda, Shinobu; Hoshino, Norihiro*; Tsuchida, Hidekazu*; Hirao, Toshio*; Oshima, Takeshi
IEEE Transactions on Nuclear Science, 60(4), p.2647 - 2650, 2013/08
Times Cited Count:18 Percentile:79.49(Engineering, Electrical & Electronic)Heavy ion induced anomalous charge collection was observed from 4H-SiC Schottky barrier diodes. It is suggested that the incident ion range with suspect to the thickness of the epi-layer of the SBD in key to understanding these observation and the understanding mechanism.
Iwamoto, Naoya; Johnson, B. C.; Hoshino, Norihiro*; Ito, Masahiko*; Tsuchida, Hidekazu*; Kojima, Kazutoshi*; Oshima, Takeshi
Journal of Applied Physics, 113(14), p.143714_1 - 143714_5, 2013/04
Times Cited Count:33 Percentile:77.52(Physics, Applied)Iwamoto, Naoya; Johnson, B. C.; Oshima, Takeshi; Hoshino, Norihiro*; Ito, Masahiko*; Tsuchida, Hidekazu*
Proceedings of 10th International Workshop on Radiation Effects on Semiconductor Devices for Space Applications (RASEDA-10) (Internet), p.62 - 65, 2012/12
Makino, Takahiro; Deki, Manato; Iwamoto, Naoya; Onoda, Shinobu; Hoshino, Norihiro*; Tsuchida, Hidekazu*; Oshima, Takeshi
Proceedings of 10th International Workshop on Radiation Effects on Semiconductor Devices for Space Applications (RASEDA-10) (Internet), p.66 - 69, 2012/12
Silicon carbide (SiC) is regarded as a promising candidate for electronic devices requiring high radiation tolerance (rad-hard devices). Some results indicate that SiC has superior radiation tolerance from the point of view of total ionizing dose effects (TIDs). For the development of rad-hard SiC devices, it is necessary to understand the response of their performance when dense charge is generated in them by an incident ion, resulting in single event effects (SEEs). Therefore, we have measured the bias dependence of the collected charge distribution induced by heavy ions in 4H-SiC-schottky barrier diodes (SBDs) fabricated in thick epi-layer to reveal SEE mechanisms. As a result, anomalous collected charge peaks (2nd peaks) induced by the heavy ions were observed for the first time. The new process of the SEB was observed in the case of incident ions on thick epi-layer of SiC-SBDs.
Onuma, Toshiharu*; Miyashita, Atsumi; Yoshikawa, Masahito; Tsuchida, Hidekazu*; Iwasawa, Misako*
Heisei-21-Nendo Sentan Kenkyu Shisetsu Kyoyo Sokushin Jigyo "Chikyu Shimyureta Sangyo Senryaku Riyo Puroguramu" Riyo Seika Hokokusho, p.21 - 27, 2010/07
Silicon carbide, being a wide-band-gap semiconductor, is an attractive material in the development of electronic devices operated under extreme conditions such as high power, high temperature, and high radiation. SiC is particularly attractive for use in MOS technology because among the compound semiconductors only silicon carbide has the thermal oxide SiO, which is a good insulator. However, it is known that SiO/SiC interfaces have a higher density of interface traps than SiO/Si interfaces and that the channel mobility of MOS devices is much lower than theoretically expected values. In order to improve these characteristics, it is important to understand the thermal oxidation process at the SiO/SiC interface. We performed large-scale first-principles molecular dynamics simulations of the SiO/SiC interface oxidation process. We also performed large-scale first-principles molecular dynamics simulations to generate amorphous SiO/SiC interface.
Storasta, L.*; Tsuchida, Hidekazu*; Miyazawa, Tetsuya*; Oshima, Takeshi
Journal of Applied Physics, 103(1), p.013705_1 - 013705_7, 2008/01
Times Cited Count:95 Percentile:93.35(Physics, Applied)A carbon-implantation/annealing method for annealing of defect Z in thick 4H-SiC epilayers was studied. Different implantation doses and annealing temperatures were examined to find the optimum conditions for annealing of Z. As the result, Z defects in epilayer with 100 m were annealed by implanting 300 nm carbon atoms at a concentration of 210/cm and sbsequent annealing at 1800 C. By this treatment, the carrier lifetime increased from less than 200 ns to over 1 s at room temperature.
Onuma, Toshiharu*; Miyashita, Atsumi; Iwasawa, Misako*; Yoshikawa, Masahito; Tsuchida, Hidekazu*
Materials Science Forum, 556-557, p.615 - 620, 2007/00
We performed the dynamical simulation of the SiO/4H-SiC(0001) interface oxidation process using first-principles molecular dynamics based on plane waves and the slab model supercells method. The heat-and-cool method is used to prepare the initial interface structure. In this structure, there is no transition oxide layer or dangling bond at the SiO/SiC interface. As the trigger of the oxidation process, the carbon vacancy is introduced in the SiC layer near the interface. The oxygen molecules are added one by one to the empty sphere in the SiO layer near the interface in the oxidation process simulation. The molecular dynamics simulation is carried out at 2500 K. The oxygen molecule is dissociated and forms bonds with the Si atom in the SiO layer. The atoms of Si in the SiC layer at the SiO/4H-SiC(0001) interface are oxidized. Carbon clusters are formed in the interface layer. Oxygen molecules react with the carbon clusters and formed CO molecules.
Miyashita, Atsumi; Onuma, Toshiharu*; Iwasawa, Misako*; Tsuchida, Hidekazu*; Yoshikawa, Masahito
Materials Science Forum, 556-557, p.521 - 524, 2007/00
SiC semiconductor devices are expected to be used in severe environments. However, SiC devices don't present the theoretically expected performance. This is considered to be attributed to the SiO/SiC interface defects that reduce electrical characteristics of devices. To generate the real device interface structure with the computer simulation, it is important to construct the a-SiO structure on SiC. The slab model using 444 atoms for a-SiO on a 4H-SiC (0001) crystal layer was constructed by using first-principles MD simulation. The heating and rapid quenching method was carried out to make an a-SiO/SiC interface structure. The heating temperature, the heating time and the speed of rapid quenching is 4000 K, 3.0 ps and -1000 K/ps, respectively. The interatomic distance and the bond angles of SiO layers agreed well with the most probable values in bulk a-SiO, and there were no coordination defects in the neighborhood of the SiC substrate.
Yoshikawa, Masahito; Ishida, Yuki*; Jikimoto, Tamotsu*; Hijikata, Yasuto*; Ito, Hisayoshi; Okumura, Hajime*; Takahashi, Tetsuo*; Tsuchida, Hidekazu*; Yoshida, Sadafumi*
Denshi Joho Tsushin Gakkai Rombunshi, C, 86(4), p.426 - 433, 2003/04
no abstracts in English
Ishida, Yuki*; Takahashi, Tetsuo*; Okumura, Hajime*; Jikimoto, Tamotsu*; Tsuchida, Hidekazu*; Yoshikawa, Masahito; Tomioka, Yuichi*; Midorikawa, Masahiko*; Hijikata, Yasuto*; Yoshida, Sadafumi*
Materials Science Forum, 389-393, p.1013 - 1016, 2002/00
Times Cited Count:4 Percentile:20.27(Materials Science, Multidisciplinary)no abstracts in English
Onuma, Toshiharu*; Miyashita, Atsumi; Iwasawa, Misako*; Yoshikawa, Masahito; Tsuchida, Hidekazu*
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Miyashita, Atsumi; Onuma, Toshiharu*; Iwasawa, Misako*; Tsuchida, Hidekazu*; Yoshikawa, Masahito
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Onuma, Toshiharu*; Miyashita, Atsumi; Iwasawa, Misako*; Yoshikawa, Masahito; Tsuchida, Hidekazu*
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Miyashita, Atsumi; Onuma, Toshiharu*; Iwasawa, Misako*; Tsuchida, Hidekazu*; Yoshikawa, Masahito
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Miyashita, Atsumi; Onuma, Toshiharu*; Yoshikawa, Masahito; Iwasawa, Misako*; Nakamura, Tomonori*; Tsuchida, Hidekazu*
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Silicon carbide (SiC) semiconductor devices are expected to be used under severe environments such as outer space and/or nuclear power plants. However, at this time, SiC devices don't present the predictable performance, since defects at interface reduce electric characteristics of them. The relation among atomic structures, interfacial defects and electric characteristics is not clear. Therefore, we tried to solve these problems by the computer simulation. The SiO/SiC interface structure is generated and the electronic geometry is decided by the first-principle molecular dynamics (MD) simulation with the Earth-Simulator. The amorphous interface structure is made by heating and rapid quench calculation using 444 atoms model. The heating temperature is 4000K, the heating time is 3.0ps, and the speed of rapid quench is . After a rapid quench, the atomic structure became an almost perfect interfacial structure. However, a few defect energy levels were still observed in the band gap. The defect energy levels are originated from the localized electronic distribution of the interfacial oxygen.
Miyashita, Atsumi; Onuma, Toshiharu*; Iwasawa, Misako*; Tsuchida, Hidekazu*; Yoshikawa, Masahito
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Miyashita, Atsumi; Onuma, Toshiharu*; Tsuchida, Hidekazu*; Yoshikawa, Masahito
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Miyashita, Atsumi; Onuma, Toshiharu*; Iwasawa, Misako*; Tsuchida, Hidekazu*; Yoshikawa, Masahito
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no abstracts in English