Initialising ...
Initialising ...
Initialising ...
Initialising ...
Initialising ...
Initialising ...
Initialising ...
Okuizumi, Mao*; Auton, C. J.*; Endo, Shunsuke; Fujioka, Hiroyuki*; Hirota, Katsuya*; Ino, Takashi*; Ishizaki, Kohei*; Kimura, Atsushi; Kitaguchi, Masaaki*; Koga, Jun*; et al.
Physical Review C, 111(3), p.034611_1 - 034611_6, 2025/03
Endo, Shunsuke; Abe, Ryota*; Fujioka, Hiroyuki*; Ino, Takashi*; Iwamoto, Osamu; Iwamoto, Nobuyuki; Kawamura, Shiori*; Kimura, Atsushi; Kitaguchi, Masaaki*; Kobayashi, Ryuju*; et al.
European Physical Journal A, 60(8), p.166_1 - 166_10, 2024/08
Times Cited Count:0 Percentile:0.00(Physics, Nuclear)Oshikawa, Takumi*; Funakoshi, Yoshihiko*; Imaoka, Hiroshi*; Yoshikawa, Kohei*; Maari, Yasutaka*; Iguchi, Masahide; Sakurai, Takeru; Nakahira, Masataka; Koizumi, Norikiyo; Nakajima, Hideo
Proceedings of 19th International Forgemasters Meeting (IFM 2014), p.254 - 259, 2014/09
ITER is a large-scale experiment that aims to demonstrate that it is possible to produce commercial energy from fusion. ITER Toroidal Field Coil Case (hereinafter referred to as "ITER TFCC") is one of the important components of ITER. The ITER TFCC materials are made of high nitrogen austenitic stainless steel and having various configurations. The ITER TFCC material which manufactured by JCFC has a complex configuration with heaver thickness than other materials. It is difficult to form near net shape to delivery configuration by ordinary open die forging method such as upset and stretching, because the ITER TFCC materials manufactured by JCFC have a complex configuration. Therefore ingot weight and lead time of machining increase when ITER TFCC materials are forged by ordinary open die forging method. Moreover, in order to get good attenuation at Ultrasonic examination, it is necessarily to make fine and uniform grain of the material. However, it is impossible to control grain size of austenitic stainless steel by heat treatment. The grain becomes fine and uniform by only forging process with suitable condition. Therefore, JCFC has studied suitable forging method to become near net shape to delivery configuration and also to get fine grain of center of the material. Based on these result, ITER TFCC materials were manufactured. This innovative forging process led to reduce the weight of ingot compared with general forging. And it had good Ultrasonic attenuation. It was confirmed that the results of material test and nondestructive examination satisfied the requirements of Japan domestic agency (hereinafter referred to as "JADA"). Moreover, the test coupons were taken from center of thick part of product and used for various tests. As the result of tests, it was confirmed that results of material test satisfied the requirements of JADA. It is clear that this innovative forging method is very suitable process for manufacturing of ITER TFCC materials.
Suzuki, Michitaka*; Yoshikawa, Mao*; Iimura, Kenji*; Satone, Hiroshi*; Ishii, Katsunori
Funtai Kogakkai-Shi, 50(6), p.405 - 409, 2013/06
The glass substrate is coated by the silica nanoparticle suspension using dipping or spin coat method and dried in an electric oven. The glass substrate surface is covered with nanoparticle thin layer and the transparent and tiny rugged surface can be produced on a substrate. It was experimentally confirmed to prevent dust adhesion by covering the surface of the glass substrate with nanoparticle. The adhesion force between particle and substrate is measured by the centrifugal method and the relation between the adhesion force and the surface roughness is discussed from experimental and theoretical point of view. The measured and calculated results by Van der Waals force show that adhesion force decreased with the increment of the surface roughness. From the results, nanoparticle coating is very effective to prevent the dust adhesion on the substrate and the various application of nanoparticle coating can be expected.
Goto, Yu*; Ito, Yuki*; Ide, Ikuo*; Ino, Takashi*; Endo, Shunsuke; Oku, Takayuki; Okudaira, Takuya*; Okuizumi, Mao*; Kameda, Kento*; Kawamura, Shiori*; et al.
no journal, ,
no abstracts in English