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Ge
alloy layer studied by real-time photoelectron spectroscopyOgawa, Shuichi*; Hozumi, Hideaki*; Yoshigoe, Akitaka; Ishizuka, Shinji*; Kaga, Toshiteru*; Teraoka, Yuden; Takakuwa, Yuji*
Oyo Butsuri Gakkai Hakumaku, Hyomen Butsuri Bunkakai, Shirikon Tekunoroji Bunkakai Kyosai Tokubetsu Kenkyukai Kenkyu Hokoku, p.67 - 70, 2011/01
The oxidation-enhanced Ge atoms condensation kinetics on an SiGe alloy layer has been investigated by the real-time photoemission spectroscopy using the synchrotron radiation. The SiGe alloy layer was formed with a thermal evaporation method on a p-type Si(001) surface, and this alloy layer was oxidized at Langmuir-type adsorption. During oxidation at 773 KC, it is found that the Ge atoms are not oxidized, only SiO
film is formed on the SiGe alloy layer. Furthermore, the desorption of GeO molecules does not occur during the oxidation of alloy layer. On the other hand, not only Si atoms but also Ge atoms are oxidized at room temperature. This difference can be explained using the unified oxidation model mediated by the point defect generation, namely it is suggested that a lot of vacancies are generated during oxidation of the SiGe alloy layer at 773K and Ge atoms diffuse through these vacancies.
C alloy layer/Si(001) surface under oxide growth and etching conditionsHozumi, Hideaki*; Ogawa, Shuichi*; Yoshigoe, Akitaka; Ishizuka, Shinji*; Harries, J.; Teraoka, Yuden; Takakuwa, Yuji*
Oyo Butsuri Gakkai Hakumaku, Hyomen Butsuri Bunkakai, Shirikon Tekunoroji Bunkakai Kyosai Tokubetsu Kenkyukai Kenkyu Hokoku, p.181 - 184, 2010/01
The oxidation kinetics on the SiC alloy layer has been investigated using the real-time XPS measurement. Experiments were performed at the BL23SU of SPring-8. The SiC alloy layer was formed with exposing a p-type Si(001) surface to ethylene, and the SiC alloy layer was oxidized at Langmuir-type adsorption (773 K) and 2D oxide island growth (933 K), respectively. In case of Langmuir-type adsorption, it is found that no carbon atoms are oxidized and carbon concentration at the SiO/Si interface increases. These results indicate the carbon atom condensation occurs, leading to the SiO/SiC/Si layers formation. On the other hand, the carbon concentration decrease by 20% in spite of the etching of 38 Si layers in the 2D oxide island growth. Based on these results, it is found that the diffusion of carbon atoms is occurred due to not only oxide growth but also Si etching.
gate dielectricsHosoi, Takuji*; Okamoto, Gaku*; Kutsuki, Katsuhiro*; Kagei, Yusuke*; Harries, J.; Yoshigoe, Akitaka; Teraoka, Yuden; Shimura, Takayoshi*; Watanabe, Heiji*
Oyo Butsuri Gakkai Hakumaku, Hyomen Butsuri Bunkakai, Shirikon Tekunoroji Bunkakai Kyosai Tokubetsu Kenkyukai Kenkyu Hokoku, p.145 - 148, 2010/01
We developed high quality high-
/Ge gate stacks with reduced leakage current and superior interface quality, which was fabricated by direct deposition of ZrO on Ge substrate and thermal oxidation. Synchrotron radiation photoelectron spectroscopy revealed that thermal oxidation at 823 K caused not only an intermixing between ZrO and Ge but also the formation of GeO at the interlayer. We obtained an equivalent oxide thickness (EOT) of 1.9 nm, and an interface state density of 10
cm
eV
for Au/ZrO/Ge capacitors. Furthermore, we found that the A10
capping on the Zr0 1ayer is effective for decreasing EOT. The interface state density as low as 5.3
10
cmeV was obtained for the AlO/ZrO/Ge stack with 30 min oxidation. The EOT could be reduced to l.6 nm by 10 min oxidation. The leakage current was two orders of magnitude lower than the conventional poly-Si/SiO/Si stack.
Yamamoto, Yoshihisa*; Suzuki, Yasushi*; Miyamoto, Yu*; Bantaculo, R.*; Suemitsu, Maki*; Enta, Yoshiharu*; Teraoka, Yuden; Yoshigoe, Akitaka; Asaoka, Hidehito; Yamazaki, Tatsuya
Hakumaku, Hyomen Butsuri Bunkakai, Shirikon Tekunoroji Bunkakai Kyosai Tokubetsu Kenkyukai Kenkyu Hokoku, p.207 - 210, 2009/01
The bending of Si substrate has been measured optically in the oxidation of Si(110) surface and variation of curvature for (001) and (-110) directions have been evaluated. Furthermore, time evolutions of oxygen adsorption content and its chemical bonding states have been measured by photoemission spectroscopy to discuss inisotropy of the Si(110) oxidation in comjunction with substrate curvature measurements. Oxygen adsorption content was evaluated from O1s photoemission and chemical bonding states were evaluated from Si2p photoemission. O gas pressure was ranging from 5.010
Pa to 6.710 and substrate temperature was 873 K. Compressive stress was detected in the (-110) direction. In turn, stretching stress was detected. The photoemission spectroscopy indicated that a layer-by-layer oxidation was not took place. The stretching stress in the (001) direction implies that oxidation of B-bonds which have components along the (001) direction takes place.