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斉藤 淳一; 澁谷 秀雄*; 小林 洋平*
Characterization of Minerals, Metals, and Materials 2020, p.563 - 571, 2020/01
被引用回数：4 パーセンタイル：85.52(Materials Science, Multidisciplinary)Liquid sodium is used for a coolant of fast reactor, because of its high thermal conductivity and high melting temperature. Wettability is one of important properties to design the apparatus of fast reactor. It is well known wettability by liquid sodium changes by surface roughness and kind of metal, etc. We propose an atomic interaction between metal and liquid sodium also relates to wettability. The purpose of this study is to understand the wettability of pure metal by liquid sodium by both of experimental and theoretical approach. High purity metal plates of titanium, vanadium, iron, nickel copper and molybdenum were used for experiment. Wettability was evaluated using the contact angle obtained by tangent method. Simple surface models were constructed for theoretical calculation. The contact angel was evaluated using two kinds of atomic bond. As a result, it became clear there was relationship between the contact angle and atomic bond.
斉藤 淳一; 小林 洋平*; 澁谷 秀雄*
no journal, ,
Wettability of pure metal by liquid sodium has been studied in order to control the wettability. In order to understand theoretically the wettability the electronic state of interface between liquid metal and substrate metal calculated and an atomic bonding at interface obtained. Consequently, it became clear that the contact angle which is one of indications of wettability was related with the atomic bonding at interface. An electronic state of interface between liquid low-melting temperature alloy and pure metal was calculated to evaluate the experimental results of wettability of pure metal using the low-melting temperature alloy. And the contact angle was evaluated by the atomic bonding of interface. The molecular orbital calculation was utilized for the calculation of electronic state of interface. The low-melting temperature alloy consists of bismuth, tin and indium. Aluminum, titanium, iron, nickel, copper, zirconium, niobium and molybdenum were selected as the substrate metal. From the calculation result an electronic density of state of interface was similar to that of bulk metal. It means the electronic state of interface was expressed well in this calculation. It became clear that an atomic bonding at interface changed with the atomic number of substrate metal. We will report a relationship between the atomic bonding and the contact angle of wettability in the presentation.
