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Journal Articles

Optimum temperature for HIP bonding invar alloy and stainless steel

Wakui, Takashi; Ishii, Hideaki*; Naoe, Takashi; Kogawa, Hiroyuki; Haga, Katsuhiro; Wakai, Eiichi; Takada, Hiroshi; Futakawa, Masatoshi

Materials Transactions, 60(6), p.1026 - 1033, 2019/06

 Times Cited Count:1 Percentile:13.55(Materials Science, Multidisciplinary)

The mercury target has large size as 1.3$$times$$1.3$$times$$2.5 m$$^{3}$$. In view of reducing the amount of wastes, we studied the structure so that the fore part could be separated. The flange is required to have high seal performance less than 1$$times$$10$$^{-6}$$ Pa m$$^{3}$$/s. Invar with low thermal expansion is a candidate. Due to its low stiffness, however, the flange may deform when it is fastened by bolts. Practically invar is reinforced with stainless steel where all interface between them has to be bonded completely with the HIP bonding. In this study, we made specimens at four temperatures and conducted tensile tests. The specimen bonded at 973 K had little diffusion layer, and so fractured at the interface. The tensile strength reduced with increasing the temperature, and the reduced amount was about 10% at 1473 K. The analyzed residual stresses near the interface increased by 50% at maximum. Then, we concluded that the optimum temperature was 1173 K.

Journal Articles

Implementation of a low-activation Au-In-Cd decoupler into the J-PARC 1 MW short pulsed spallation neutron source

Teshigawara, Makoto; Ikeda, Yujiro; Oi, Motoki; Harada, Masahide; Takada, Hiroshi; Kakishiro, Masanori*; Noguchi, Gaku*; Shimada, Tsubasa*; Seita, Kyoichi*; Murashima, Daisuke*; et al.

Nuclear Materials and Energy (Internet), 14, p.14 - 21, 2018/01

 Times Cited Count:0 Percentile:0.01(Nuclear Science & Technology)

We developed an Au-In-Cd (AuIC) decoupler material to reduce induced radioactivity instead of Ag-In-Cd one, which has a cut off energy of 1eV. In order to implement it into an actual moderator-reflector assembly, a number of critical engineering issues need to be resolved with regard to large-sized bonding between AuIC and A5083 alloys by the hot isostatic pressing process. We investigated this process in terms of the surface conditions, sizes, and heat capacities of large AuIC alloys. We also show a successful implementation of an AuIC decoupler into a reflector assembly, resulting in a remarkable reduction of radioactivity by AuIC compared to AIC without sacrificing neutronic performance.

Journal Articles

Development of fabrication technology of ITER shielding blanket

Enoeda, Mikio

Koon Gakkai-Shi, 30(5), p.256 - 262, 2004/09

Fabrication technologies for ITER in-vessel components, especially the shielding blanket with the separable first wall panel has been developed. Hot Isostatic Pressing (HIP) has been applied to the bonding of Cu-alloy/stainless steel and beryllium/Cu-alloy. First wall mock-ups fabricated by using HIP were tested under high heat fluxes and showed sufficient heat removal and thermal fatigue performance. Water jet and electrical discharge machining have been applied to manufacture slots into the first wall panel and the shield block. With these technologies, a first wall panel prototype and a shielding block 1/2 mock-up were successfully fabricated.

Oral presentation

Optimization of condition for invar/stainless HIP diffusion bonding

Wakui, Takashi; Naoe, Takashi; Kogawa, Hiroyuki; Haga, Katsuhiro; Wakai, Eiichi; Takada, Hiroshi; Futakawa, Masatoshi

no journal, , 

The mercury target vessel has large size as 1.3$$times$$1.3$$times$$2.5 m$$^{3}$$. In view of reducing the amount of wastes, we have studied the structure so that the fore part could be separated. The flange is required to have high seal performance less than 1$$times$$10$$^{-6}$$ Pam$$^{3}$$/s. Invar with low thermal expansion is a candidate. Due to its low stiffness, however, the flange may deform when it is fastened by bolts. Practically invar is reinforced with stainless steel where all interface between them has to be bonded completely with the HIP bonding. In this study, we made specimens at four temperatures of 973, 1173, 1373 and 1473 K and conducted tensile tests. The specimen bonded at 973 K had little diffusion layer, and so fractured at the interface. The tensile strength reduced with increasing the temperature, and the reduced amount was about 10 % at 1473 K. The analyzed residual stresses near the interface increased by 50 % at maximum. Then, we concluded that the optimum temperature was 1173 K.

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