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Journal Articles

Solid spallation target materials development

Kawai, Masayoshi*; Furusaka, Michihiro; Li, J.-F.*; Kawasaki, Akira*; Yamamura, Tsutomu*; Mehmood, M.*; Kurishita, Hiroaki*; Kikuchi, Kenji; Takenaka, Nobuyuki*; Kiyanagi, Yoshiaki*; et al.

Proceedings of ICANS-XVI, Volume 3, p.1087 - 1096, 2003/07

In order to establish the technique fabricating a thin target slab with a real size, thin tantalum-clad tungsten slab with a hole for a thermocouple was fabricated with the high-precision machinery techniques and the HIP'ing method. The ultrasonic diagnostic showed that tantalum and tungsten bond was perfect. The HIP optimum condition was certified by means of the small punch test as already reported. The electrolytic coating technique in a molten salt was developed to make a thinner tantalum cladding on a tungsten target with a complicated shape, in order to reduce radioactivity from tantalum in an irradiated target.

Journal Articles

Electro-deposition of tantalum on tungsten and nickel in LiF-NaF-CaF$$_{2}$$ melt containing K$$_{2}$$TaF$$_{7}$$; Electrochemical study

Mehmood, M.*; Kawaguchi, Nobuaki*; Maekawa, Hideki*; Sato, Yuzuru*; Yamamura, Tsutomu*; Kawai, Masayoshi*; Kikuchi, Kenji

Materials Transactions, 44(2), p.259 - 267, 2003/02

https://doi.org/10.2320/matertrans.44.259
 Times Cited Count：9 Percentile：52.06(Materials Science, Multidisciplinary)

Electrochemical study has been carried out on the electro-deposition of tantalum in LiF-NaF-CaF$$_{2}$$ melt containing K$$_{2}$$TaF$$_{7}$$ at 700$$^{circ}$$C. This has been done for determining the mechanistic features for preparing electrolytic coating of tantalum on nickel and tungsten substrates. Electro-deposition of metallic tantalum occurs primarily by electro-reduction of Ta(V). Pure metallic tantalum without any entrapped salt is successfully deposited on tungsten by galvanostatic polarization at reasonably low current densities. An additional feature on nickel is the formation of an intermetallic compound at potential 0.25V nobler than that of pure tantalum as a result of underpotential deposition of tantalum. This intermetallic compound covers the surface within a short time followed by deposition of pure tantalum, although intermetallic compound keeps growing at the interface of pure tantalum deposit and the substrate as a result of diffusion.

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