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Kumazoe, Hiroyuki*; Igarashi, Yasuhiko*; Iesari, F.*; Shimizu, Ryota*; Komatsu, Yuya*; Hitosugi, Taro*; Matsumura, Daiju; Saito, Hiroyuki*; Iwamitsu, Kazunori*; Okajima, Toshihiko*; et al.
AIP Advances (Internet), 11(12), p.125013_1 - 125013_5, 2021/12
Times Cited Count:2 Percentile:17.05(Nanoscience & Nanotechnology)Yamada, Takahiro*; Watanabe, Kenta*; Nozaki, Mikito*; Yamada, Hisashi*; Takahashi, Tokio*; Shimizu, Mitsuaki*; Yoshigoe, Akitaka; Hosoi, Takuji*; Shimura, Takayoshi*; Watanabe, Heiji*
Applied Physics Express, 11(1), p.015701_1 - 015701_4, 2018/01
Times Cited Count:39 Percentile:84.61(Physics, Applied)A simple and feasible method for fabricating high-quality and highly reliable GaN-based metal-oxide-semiconductor (MOS) devices was developed on the basis of systematic physical and electrical characterizations. Chemical vapor deposition of SiO films directly onto GaN substrates forming Ga-oxide interlayers was used to fabricate SiO/GaO/GaN stacked structures. Although well-behaved hysteresis-free GaN-MOS capacitors with extremely low interface state density below 10cmeV were obtained by post-deposition annealing, Ga diffusion into overlying SiO layers severely degraded the insulating property and dielectric breakdown characteristics of the MOS devices. However, this problem was found to be solved by employing rapid thermal processing, leading to superior performance of the GaN-MOS devices in terms of interface quality, insulating property and gate dielectric reliability.
Takahashi, Naoki; Yoshinaka, Kazuyuki; Harada, Akio; Yamanaka, Atsushi; Ueno, Takashi; Kurihara, Ryoichi; Suzuki, Soju; Takamatsu, Misao; Maeda, Shigetaka; Iseki, Atsushi; et al.
Nihon Genshiryoku Gakkai Homu Peji (Internet), 64 Pages, 2016/00
no abstracts in English
Mukai, Yasunobu; Nakamura, Hironobu; Nakamichi, Hideo; Kurita, Tsutomu; Noguchi, Yoshihiko*; Tamura, Takayuki*; Ikegame, Ko*; Shimizu, Junji*
Proceedings of INMM 56th Annual Meeting (Internet), 9 Pages, 2015/07
The PIMS used at Rokkasho Reprocessing Plant can quantify plutonium amount in each process vessel located inside glovebox by means of neutron measurement. Since the PIMS is not used for the neutron coincidence counting, it is very important to maintain that those constants meet the actual process condition. PIMS was calibrated in 2006, and then JNFL has been started to measure the Pu amount directly in each glovebox for the purpose of facility NMA. However, it was found that PIMS counting was unexpectedly and continuously increased during long time of inter-campaign. In order to find out the main cause, JAEA and JNFL jointly conducted several investigations. In the investigations, correctness of system parameters and relevant constants, behavior of the neutron generation when MOX powder is stored in actual glovebox for a long time (to see O/M and moisture change) and the behavior focused on the relation between MOX powder and light element using inside glovebox (fluorine is included in the PTFE which is used in many gloveboxes as packing of instruments) were experimentally confirmed using MOX powder in PCDF. As a result, since the same behavior happened in the actual PIMS was confirmed in the testing environment in which MOX powder coexists with fluorine, it is concluded that the main potential cause of PIMS is the increasing of the probability of (, ) reactions by a contact between PTFE and MOX powder.
Sugimoto, Masahiro*; Kosugi, Keizo*; Katayama, Kota*; Ii, Hideki*; Takagi, Akira*; Endo, Sakaru*; Shimizu, Hitoshi*; Tsubouchi, Hirokazu*; Kizu, Kaname; Yoshida, Kiyoshi
Proceedings of 24th International Cryogenic Engineering Conference (ICEC 24) and International Cryogenic Materials Conference 2012 (ICMC 2012) (CD-ROM), p.799 - 802, 2012/05
We have successfully manufactured all superconducting cables for CS and EF coils of JT-60SA. The low temperature performance of superconducting wires satisfied the specifications under sufficiently low deviations and high production yields. Ni-plated strands of EF cables having the larger sliding friction between strands than that of Cr-plated strands of CS cable caused difficulties on the cabling without any defects. Consequently, the newly developed cabling techniques with the original inspection apparatus significantly enhanced the manufacturability and were effective for guarantee of the quality.
Konoshima, Shigeru; Leonard, A. W.*; Ishijima, Tatsuo*; Shimizu, Katsuhiro; Kamata, Isao*; Meyer, W. H.*; Sakurai, Shinji; Kubo, Hirotaka; Hosogane, Nobuyuki; Tamai, Hiroshi
Plasma Physics and Controlled Fusion, 43(7), p.959 - 983, 2001/07
Times Cited Count:30 Percentile:66.88(Physics, Fluids & Plasmas)no abstracts in English
; Koide, Kaoru*; *; Yoshida, Eiichi; *; ; Fujita, Tomoo
PNC TN1410 97-038, 307 Pages, 1996/04
no abstracts in English
*; Kunugi, Tomoaki; *
ASME Proc. of 31st National Heat Transfer Conf. (HTD-Vol. 323), 1, p.171 - 178, 1996/00
no abstracts in English
Kunugi, Tomoaki; *; *
Proc. of 2nd Japan-Central Europe Joint Workshop on Modelling of Materials and Combustion, 0, p.205 - 208, 1996/00
no abstracts in English
Kunugi, Tomoaki; *; *
Dai-32-Kai Nihon Dennetsu Shimpojiumu Koen Rombunshu, 0, p.565 - 566, 1995/05
no abstracts in English
Kunugi, Tomoaki; *; *; *
Fusion Engineering and Design, 28, p.63 - 71, 1995/00
no abstracts in English
*; Kunugi, Tomoaki; *
Therm. Sci. Eng., 3(4), p.27 - 33, 1995/00
no abstracts in English
; ; Shimizu, Toku; Saito, Keiichiro; ; ; *; Naruse, Yuji
JAERI-M 8494, 291 Pages, 1979/10
no abstracts in English
Mogaki, Kazuhiko; Hanada, Masaya; Kawai, Mikito; Kazawa, Minoru; Akino, Noboru; Komata, Masao; Usui, Katsutomi; Oasa, Kazumi; Kikuchi, Katsumi; Shimizu, Tatsuo; et al.
no journal, ,
no abstracts in English
Shimizu, Katsusuke*; Minatsuki, Isao*; Otani, Tomomi*; Mizokami, Yoritaka*; Oyama, Sunao*; Tsukamoto, Hiroki*; Kunitomi, Kazuhiko; Tachibana, Yukio; Terada, Atsuhiko
no journal, ,
no abstracts in English