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Wakui, Takashi; Ishii, Hideaki*; Naoe, Takashi; Kogawa, Hiroyuki; Haga, Katsuhiro; Wakai, Eiichi; Takada, Hiroshi; Futakawa, Masatoshi
Materials Transactions, 60(6), p.1026 - 1033, 2019/06
Times Cited Count：3 Percentile：17.96(Materials Science, Multidisciplinary)The mercury target has large size as 1.3
1.32.5 m
. In view of reducing the amount of wastes, we studied the structure so that the fore part could be separated. The flange is required to have high seal performance less than 110
Pa m/s. Invar with low thermal expansion is a candidate. Due to its low stiffness, however, the flange may deform when it is fastened by bolts. Practically invar is reinforced with stainless steel where all interface between them has to be bonded completely with the HIP bonding. In this study, we made specimens at four temperatures and conducted tensile tests. The specimen bonded at 973 K had little diffusion layer, and so fractured at the interface. The tensile strength reduced with increasing the temperature, and the reduced amount was about 10% at 1473 K. The analyzed residual stresses near the interface increased by 50% at maximum. Then, we concluded that the optimum temperature was 1173 K.
Wakui, Takashi; Ishii, Hideaki*; Naoe, Takashi; Suzuki, Hiroshi; Harjo, S.; Futakawa, Masatoshi
no journal, ,
In the diffused bonding by HIP of invar alloy with a low-thermal expansion coefficient and common metal, large residual stresses occurs near the bonding line due to difference with a big thermal expansion coefficient and then we are anxious about the strength reduction by the residual stresses. In this study, some tests for bonding specimen were carried out. The diffusion layer with thickness of 50 micro meter occurred near the bonding line. The neutron diffraction method could not measure the residual stress. In tensile tests, all fractures occurred in invar alloy side and the bonding strength was higher than the strength of Invar alloy. The grain size increased with an increase of treatment temperature and the tensile strength decreased with an increase of the grain size.
Wakui, Takashi; Ishii, Hideaki*; Naoe, Takashi; Wan, T.*; Xiong, Z.*; Haga, Katsuhiro; Takada, Hiroshi; Futakawa, Masatoshi
no journal, ,
no abstracts in English
Ishii, Hideaki*; Wakui, Takashi; Naoe, Takashi; Wan, T.; Xiong, Z.*; Haga, Katsuhiro; Takada, Hiroshi; Futakawa, Masatoshi
no journal, ,
no abstracts in English
