Initialising ...
Initialising ...
Initialising ...
Initialising ...
Initialising ...
Initialising ...
Initialising ...
Yamaguchi, Kenji; Heya, Akira*; Shimura, Kenichiro; Katsumata, Toshinobu*; Yamamoto, Hiroyuki; Hojo, Kiichi
Thin Solid Films, 461(1), p.17 - 21, 2004/08
Times Cited Count:4 Percentile:25.12(Materials Science, Multidisciplinary)no abstracts in English
Yamaguchi, Kenji; Haraguchi, Masaharu*; Katsumata, Toshinobu*; Shimura, Kenichiro; Yamamoto, Hiroyuki; Hojo, Kiichi
Thin Solid Films, 461(1), p.13 - 16, 2004/08
Times Cited Count:10 Percentile:46.84(Materials Science, Multidisciplinary)no abstracts in English
Shimura, Kenichiro; Katsumata, Toshinobu*; Yamaguchi, Kenji; Yamamoto, Hiroyuki; Hojo, Kiichi
Thin Solid Films, 461(1), p.22 - 27, 2004/08
Times Cited Count:8 Percentile:41.01(Materials Science, Multidisciplinary)On the formation of -FeSi using Ion Beam Sputter Deposition (IBSD) method, sputter etching (SE) followed by thermal annealing is effective substrate treatment to obtain highly (100) oriented -FeSi on Si (100). However the best condition of these treatments are not yet known. In this work, the effect of sputter etching (SE) together with annealing process on the orientation of the film is investigated. In prior to the deposition of Fe, the substrate is irradiated by Ne ion with various energy and fluence followed by thermal annealing at 1027 K for 60 minuets. The overall results show the most suitable SE condition using Ne ion on IBSD method is the energy of 1keV with the fluence of 3010 ions/m.
Igarashi, Shinichi*; Katsumata, Toshinobu*; Haraguchi, Masaharu*; Saito, Takeru*; Yamaguchi, Kenji; Yamamoto, Hiroyuki; Hojo, Kiichi
Vacuum, 74(3-4), p.619 - 624, 2004/06
Times Cited Count:6 Percentile:27.83(Materials Science, Multidisciplinary)no abstracts in English
Igarashi, Shinichi; Katsumata, Toshinobu; Haraguchi, Masaharu; Saito, Takeru; Yamaguchi, Kenji; Yamamoto, Hiroyuki; Hojo, Kiichi
Transactions of the Materials Research Society of Japan, 28(4), p.1153 - 1156, 2003/12
We have evaluated the crystal structure of the -FeSi films formed with various sputter etching of Si substrate. Ne sputter etching of Si (100) substrate was performed with ion energies of 1, 3, and 10 keV. After each etching, the substrate was annealed at a temperature of 1073 K for 30 min. The -FeSi films of 100 nm in thickness were formed at 973 K with the amount of deposited Fe, 30 nm. X-ray diffraction revealed that these films have polycrystalline -FeSi structure but strong preferential orientation aligned as -FeSi (100) // Si (100). Furthermore, the oriented structure of the film was improved by lowering the incident energy of Ne.