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Report No.
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Corrosion Rate and Corrosion Localization of Pure Copper in Simulated Groundwater under Aerated Condition

Kawasaki, Manabu*; Taniguchi, Naoki ; Kawakami, Susumu

Copper is one of the candidate materials for overpacks and it is important to understand the corrosion behavior under oxidizing condition at the initial stage of repository. For understanding the influence of environmental factor on the corrosion rate of copper and corrosion localization, immersion tests of pure copper in aqueous solution and in bentonite were carried out under aerated condition in simulated groundwater environment.As the result, corrosion rate increased with increase in chloride ion concentration and fluoride ion concentration. The addition of bicarbonate ion reduced the corrosion rate of pure copper in the presence of chloride ion. The corrosion rates in bentonite were smaller than those in aqueous solution without bentonite, and decreased with increase in solid- (bentonite)/liquid(solution) ratio. For corrosion localization, the relationship between average corrosion depth and pitting factor was investigated. Although the magnitude of pitting factor depended on the experimental condition, it was tend to decrease with increase in average corrosion depth in all test cases. No data on pitting factor was over the upper limit level observed in natural soils. It was indicated that the maximum corrosion depth due to oxygen can be evaluated conservatively by estimating the upper limit of pitting factor from average corrosion depth.

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