Development of wide range monitor for HTTR; Improvement for heat resistance performance against heat cycle

Kozawa, Takayuki; Suganuma, Takuro; Homma, Fumitaka; Higashimura, Keisuke*; Ukai, Takayuki*; Saito, Kenji 

To improve the reliability of the HTTR wide range monitor in a high-temperature environment, structural changes of the wide range monitor were investigated. It was clear that the structure for directly joins of the MI cable core wire and metal tube instead of the joins with lead wire is the most reliable method with shortest way. From a result of the thermal cycle tests and high temperature endurance tests for a mock-up connecting this connection parts, it was clear that the soundness of the connection part was maintained under the usage conditions of the HTTR.