Representative country of application |
: | 日本 |
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Application number |
: | 2018-200792 |
Publication number |
: | 2020-067392 |
Patent number |
: | 7153324 |
Date of filing |
: | 2018/10/25 |
Date of publication |
: | 2020/04/30 |
Date of patent |
: | 2022/10/05 |
International patent classification |
: | G01N23/2252(2018.01) |
Relevant patent |
: | 特開 2009-244127, セメント硬化体中の空隙部を検出する方法特許第 3866257 号 亀裂の三次元形状及び開口幅の測定方法及び測定装置 |
Relevant other documents |
: | Takano, M. et al., J. Nucl. Sci. Technol, 51, (2014) 日本表面科学会編、電子プローブマイクロアナライザー,p.11 (1998)、R. Kasada. et al.,Scientific Reports, 6(2016), 25700. |
Published unexamined patent application |
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Link for Patent Gazette |
: | |
Licensable Patent Information Database |
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Access From 2021.3.1 |
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- Accesses |
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