検索対象:     
報告書番号:
※ 半角英数字
 年 ~ 
 年

Strength proof evaluation of diffusion-jointed W/Ta interfaces by small punch test

W/Ta拡散接合材の微小押し込み試験による強度評価

Li, J.-F.*; 川合 將義*; 菊地 賢司; 五十嵐 廉*; 栗下 裕明*; 渡辺 龍三*; 川崎 亮*

Li, J.-F.*; Kawai, Masayoshi*; Kikuchi, Kenji; Igarashi, Tadashi*; Kurishita, Hiroaki*; Watanabe, Ryuzo*; Kawasaki, Akira*

タンタルで被覆したタングステン固体ターゲットを核破砕中性子源に使う場合、接合強度が問題となる。そこで、HIP接合材の機械的強度を、微小押し込み試験と有限要素法により、評価した。接合温度を変えて試験片を作製した。亀裂はいずれの場合でも界面からタングステン側に進展した。界面に沿った亀裂はなかった。タングステンの再結晶化は強度の低下を招いた。亀裂進展に耐えた最適接合条件では、機械的強度は1000MPaを超えることがわかった。

For the development of tantalum-clad tungsten targets for spallation neutron sources, the bonding strength of tantalum-tungsten interface was investigated by means of an easy-to-use and miniaturized small punch (SP) test, in which a punching load is vertically applied to the center of a jointed disk. Cracks initiated and propagated in the tungsten side for all the samples hot-isostatically pressed (HIPed) at temperatures from 1673 to 2073 K, whereas nocrack and debonding were observed in the interface, indicating that the jointed interface is strongly bonded. The re-crystallization of tungsten occurs and results in its strength reduction, consequently the crack-initiating load decreases with HIPing temperature. The finite element analysis of the measured SP testing results shows that the maximum bonding strength can exceed 1000 MPa. The present study shows that SP test is suitable for the strength evaluation of jointed tantalum-tungsten interfaces.

Access

:

- Accesses

InCites™

:

パーセンタイル:32.91

Altmetrics

:

[CLARIVATE ANALYTICS], [WEB OF SCIENCE], [HIGHLY CITED PAPER & CUP LOGO] and [HOT PAPER & FIRE LOGO] are trademarks of Clarivate Analytics, and/or its affiliated company or companies, and used herein by permission and/or license.