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Effect of nitrogen incorporation into Al-based gate insulators in AlON/AlGaN/GaN metal-oxide-semiconductor structures

AlON/AlGaN/GaN金属-酸化物-半導体構造中のAl絶縁物中への窒素取り込み効果

淺原 亮平*; 野崎 幹人*; 山田 高寛*; 伊藤 丈予*; 中澤 敏志*; 石田 昌宏*; 上田 哲三*; 吉越 章隆; 細井 卓治*; 志村 考功*; 渡部 平司*

Asahara, Ryohei*; Nozaki, Mikito*; Yamada, Takahiro*; Ito, Joyo*; Nakazawa, Satoshi*; Ishida, Masahiro*; Ueda, Tetsuzo*; Yoshigoe, Akitaka; Hosoi, Takuji*; Shimura, Takayoshi*; Watanabe, Heiji*

熱安定性, 信頼性および界面特性の観点でALGaN/GaN上のAlONゲート絶縁物の優れた物理的および電気的特性が、AlON堆積後のアニールによって得られた。アルミナへの窒素混入によって絶縁物/AlGaN界面におけるインターミキシングを抑えるとともにAl$$_{2}$$O$$_{3}$$膜中の電気的な欠陥の数を減少させることが示された。結果として、電荷注入に対する安定性をもたらすとともに界面欠陥密度を1.2$$times$$10$$^{11}$$cm$$^{-2}$$ eV$$^{-1}$$に抑えた高品質AlON/AlGaN/GaN金属-絶縁物-半導体キャパシターを得ることができた。絶縁物への窒素取り込みの重要性を実験結果から議論した。

The superior physical and electrical properties of AlON gate dielectrics on AlGaN/GaN substrates in terms of thermal stability, reliability, and interface quality were demonstrated by direct AlON deposition and subsequent annealing. Nitrogen incorporation into alumina was proven to be beneficial both for suppressing intermixing at the insulator/AlGaN interface and reducing the number of electrical defects in Al$$_{2}$$O$$_{3}$$ films. Consequently, we achieved high-quality AlON/AlGaN/GaN metal-oxide-semiconductor capacitors with improved stability against charge injection and a reduced interface state density as low as 1.2$$times$$10$$^{11}$$ cm$$^{-2}$$eV$$^{-1}$$. The impact of nitrogen incorporation into the insulator was discussed on the basis of experimental findings.

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パーセンタイル:13.55

分野:Physics, Applied

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