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Ge diffusion and bonding state change in metal/high-$$k$$/Ge gate stacks and its impact on electrical properties

金属/高誘電率材料/GeゲートスタックにおけるGe拡散と化学結合状態の変化、及び、その電気特性に与える影響

細井 卓治*; 秀島 伊織*; 田中 亮平*; 箕浦 佑也*; 吉越 章隆; 寺岡 有殿; 志村 考功*; 渡部 平司*

Hosoi, Takuji*; Hideshima, Iori*; Tanaka, Ryohei*; Minoura, Yuya*; Yoshigoe, Akitaka; Teraoka, Yuden; Shimura, Takayoshi*; Watanabe, Heiji*

Ge diffusion and chemical bonding states in metal/high-$$k$$/Ge gate stacks were investigated by synchrotron photoemission spectroscopy to understand their impact on electrical properties. Although Hf germanide was found in HfO$$_{2}$$/GeO$$_{x}$$/Ge gate stacks, such germanide could be fully oxidized by using plasma-assisted oxidation. However, Al electrode on HfO$$_{2}$$/GeO$$_{x}$$/Ge stacks reduced interfacial GeO$$_{x}$$ layer, resulting in the formation of Al germanide at the Al/HfO$$_{2}$$ interface. No germanide was formed in the stacks with inert Pt electrode, suggesting the Al layer may promote upward diffusion of GeO molecules through the HfO$$_{2}$$ layer. Hf germanide was formed near the HfO$$_{2}$$/GeO$$_{x}$$ interface probably due to Ge intermixing with the HfO$$_{2}$$ layer in the Pt-gate stacks, in contrast to the enhanced formation of Al germanide in Al-gate stacks. The formation of metal germanide led to severe degradation of insulating properties in metal/high-$$k$$/Ge stacks.

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パーセンタイル:41.28

分野:Engineering, Electrical & Electronic

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