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Consumption kinetics of Si atoms during growth and decomposition of very thin oxide on Si(001) surfaces

Si(001)表面極薄酸化膜の成長と分解におけるSi原子の消費速度論

小川 修一*; 吉越 章隆; 石塚 眞治*; 寺岡 有殿; 高桑 雄二*

Ogawa, Shuichi*; Yoshigoe, Akitaka; Ishizuka, Shinji*; Teraoka, Yuden; Takakuwa, Yuji*

Si(001)表面極薄酸化膜の成長とその後の分解過程における表面凹凸の変化をオージェ電子分光(AES)機能の付随した高速電子線回折(RHEED)で実時間観察し、さらに、走査トンネル顕微鏡(STM)で巨視的に観察した。RHEED観察から、690$$^{circ}$$Cでの二次元島成長モードでは表面のエッチングがシリコンの核化とその二量体の欠陥の横広がりで起こることが明らかになった。一方で、酸化膜は709$$^{circ}$$Cでは分解し、ステップフローモードでSi原子が消費される。しかし、酸化膜が一部分解した表面のSTM像ではステップフローエッチングではなく、ボイドの中の平坦なテラスに直径が10-20オングストロームのSi島が多く見られた。これらの結果はSiクラスターとSiO$$_{2}$$の中間的な二次元島成長でできたSiリッチな酸化膜の相分離とその分解過程におけるテラス上でのSiの析出を意味している。

The surface morphological change during growth and subsequent decomposition of very thin oxide on Si(001) surface was observed in real time by RHEED combined with AES and macroscopically by STM. The RHEED intensity ratio between half-order spots revealed that etching of the surface took place in a manner of nucleation and lateral growth of dimer vacancy on the terrace during two-dimensional (2D) oxide island growth at 690$$^{circ}$$C, whereas the resultant oxide layer was decomposed at 709$$^{circ}$$C with consumption of Si atom in a step flow mode. STM observation of the partially oxide decomposed surface, however, showed that a number of Si islands with 10-20 angstrom in diameter remained randomly over the rather atomically flat terraces within voids in spite of the step-flow etching. These results are considered in terms of the phase separation of Si-rich oxide grown by 2D oxide island growth mode between Si clusters and a stoichiometric SiO$$_{2}$$ matrix and subsequent precipitation of Si islands on the terrace during decomposition.

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パーセンタイル:51.1

分野:Materials Science, Multidisciplinary

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