Growth temperature dependence of strain relaxation during InGaAs/GaAs(0 0 1) heteroepitaxy

InGaAs/GaAs(001)ヘテロ成長中のひずみ緩和の成長温度依存性

佐々木 拓生*; 鈴木 秀俊*; 崔 炳久*; 高橋 正光; 藤川 誠司; 神谷 格*; 大下 祥雄*; 山口 真史*

Sasaki, Takuo*; Suzuki, Hidetoshi*; Sai, Akihisa*; Takahashi, Masamitsu; Fujikawa, Seiji; Kamiya, Itaru*; Oshita, Yoshio*; Yamaguchi, Masafumi*

InGaAs/GaAs(001)の分子線エピタキシャル成長中のひずみ緩和の様子をその場X線逆格子マッピングにより解析した。成長温度420, 445, 477Cにおける残留ひずみ・結晶性の変化の様子が測定された。Dodson-Tsaoの運動学的モデルは、実験による残留ひずみの測定結果とよく一致することがわかった。さらにひずみ緩和過程における転位の運動の温度依存性の解析から、転位の運動の熱励起を議論することが可能になった。

Growth temperature dependence of strain relaxation during InGaAs/GaAs(001) molecular beam epitaxy was studied by in situ X-ray reciprocal space mapping. Evolution of the residual strain and crystal quality for the InGaAs film was obtained as a function of film thickness at growth temperatures of 420, 445 and 477 C. In the early stages of strain relaxation, it was found that evolution of the residual strain and crystal quality was dependent on the growth temperature. In order to discuss this observation quantitatively, the strain relaxation model was proposed based on the Dodson-Tsao kinetic model, and its validity was demonstrated by good agreement with the experimental residual strain. Additionally, rate coefficients reflecting dislocation motions during strain relaxation were obtained as a function of growth temperature and strain relaxation was discussed in terms of the thermally active dislocation motion.